A D-Band Micromachined End-Fire Antenna in 130-nm SiGe BiCMOS Technology

The design of a radiation-efficient D-band end-fire on-chip antenna utilizing a localized back-side etching (LBE) technique, as well as an antenna-in-package (AiP) on a low-cost organic substrate, is presented. Quasi-Yagi-Uda antennas are chosen for end-fire radiation because of their compact size....

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Veröffentlicht in:	IEEE transactions on antennas and propagation 2015-06, Vol.63 (6), p.2449-2459
Hauptverfasser:	Khan, Wasif Tanveer, Ulusoy, A. Cagri, Dufour, Gaetan, Kaynak, Mehmet, Tillack, Bernd, Cressler, John D., Papapolymerou, John
Format:	Artikel
Sprache:	eng
Schlagworte:	Antenna measurements Antenna radiation patterns Antenna-in-package (AiP) Cavity resonators liquid crystal polymer (LCP) localized back-side etching micro-machining mm-waves on-chip antenna SiGe BiCMOS Silicon Substrates System-on-chip
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