Liquid Flux Assisted Bump Bonding Process And Thermal Design For Laser Arrays For Optical Interconnection

Recently, there have been intense industrial efforts in parallel optical interconnection technology2 to overcome the well known copper barrier problems in high speed (- 1 Gb/sec) data communication and processing networks of multi-processor systems. A 18x1 edge-emitting uncooled InP laser array3 (Fi...

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Bibliographische Detailangaben

Hauptverfasser:	Yiu Man Wong, Chen, H., Kossives, D., Warning, F., Doherty, C.J., Mullally, T., Anthony, L.J., Lau, M., Frye, R.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding High speed optical techniques Indium phosphide Optical arrays Optical design Optical interconnections Optical sensors Process design Surface emitting lasers Vertical cavity surface emitting lasers
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