Liquid Flux Assisted Bump Bonding Process And Thermal Design For Laser Arrays For Optical Interconnection
Recently, there have been intense industrial efforts in parallel optical interconnection technology2 to overcome the well known copper barrier problems in high speed (- 1 Gb/sec) data communication and processing networks of multi-processor systems. A 18x1 edge-emitting uncooled InP laser array3 (Fi...
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| creator | Yiu Man Wong Chen, H. Kossives, D. Warning, F. Doherty, C.J. Mullally, T. Anthony, L.J. Lau, M. Frye, R. |
| description | Recently, there have been intense industrial efforts in parallel optical interconnection technology2 to overcome the well known copper barrier problems in high speed (- 1 Gb/sec) data communication and processing networks of multi-processor systems. A 18x1 edge-emitting uncooled InP laser array3 (Figure 1) and a 32x1 surface emitting laser array4 are bump bonded to silicon optical bench piece with the help of liquid flux solder reflow process. Effects of liquid flux on some device characteristics are presented in Table 1 a and b. |
| doi_str_mv | 10.1109/LEOSST.1993.696878 |
| format | Conference Proceeding |
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A 18x1 edge-emitting uncooled InP laser array3 (Figure 1) and a 32x1 surface emitting laser array4 are bump bonded to silicon optical bench piece with the help of liquid flux solder reflow process. 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A 18x1 edge-emitting uncooled InP laser array3 (Figure 1) and a 32x1 surface emitting laser array4 are bump bonded to silicon optical bench piece with the help of liquid flux solder reflow process. 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A 18x1 edge-emitting uncooled InP laser array3 (Figure 1) and a 32x1 surface emitting laser array4 are bump bonded to silicon optical bench piece with the help of liquid flux solder reflow process. Effects of liquid flux on some device characteristics are presented in Table 1 a and b.</abstract><pub>IEEE</pub><doi>10.1109/LEOSST.1993.696878</doi></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISBN: 0780312848 |
| ispartof | LEOS 1993 Summer Topical Meeting Digest on Optical Microwave Interactions/Visible Semiconductor Lasers/Impact of Fiber Nonlinearities on Lightwave Systems/Hybrid Optoelectronic Integration and Packagi, 1993, p.H33-H34 |
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| language | eng |
| recordid | cdi_ieee_primary_696878 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | Bonding High speed optical techniques Indium phosphide Optical arrays Optical design Optical interconnections Optical sensors Process design Surface emitting lasers Vertical cavity surface emitting lasers |
| title | Liquid Flux Assisted Bump Bonding Process And Thermal Design For Laser Arrays For Optical Interconnection |
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