Thermal Management of Hotspots With a Microjet-Based Hybrid Heat Sink for GaN-on-Si Devices

The direct-die-attached cooling solution with a diamond heat spreader and hybrid Si heat sink has been developed for hotspot cooling of a GaN-on-Si device. The hybrid heat sink combines the benefits of microchannel flow and microjet impingement. In the fabricated test chip, the small hotspot is used...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2014-09, Vol.4 (9), p.1441-1450
Hauptverfasser:	Han, Yong, Lau, Boon Long, Zhang, Xiaowu, Leong, Yoke Choy, Choo, Kok Fah
Format:	Artikel
Sprache:	eng
Schlagworte:	Electronic cooling Finite element analysis heat dissipation capability Heat sinks Heat transfer Heating high-electron mobility transistor (HEMT) hotspot Logic gates Microchannel microchannel heat sink (MCHS) microjet impingement Product design Silicon
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