3D-integrated, low-height, small module design techniques for 4.48GHz, 560MHz-bandwidth TransferJet™ transceiver

A low-height, small module for 4.48GHz carrier frequency, 560MHz bandwidth transceiver has been designed employing 3D integration technology. An LSI integrated with RF and digital baseband circuits is embedded in an organic resin substrate of the module to achieve a small module size of 4.8mm × 4.8m...

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Bibliographische Detailangaben

Hauptverfasser:	Agawa, Kenichi, Seto, Ichiro, Happoya, Akihiko, Iida, Yoshihiro, Imaizumi, Yusuke, Okano, Motochika, Suzuki, Daigo, Sato, Yuichi, Iwanaga, Masaomi, Sato, Kazumi, Arai, Satoshi, Uchida, Noriaki, Ryugo, Koji, Miyashita, Daisuke, Fujimoto, Ryuichi, Unekawa, Yasuo
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	3D integration Band-pass filters Degradation high frequency Impedance matching Large scale integration low-height module Parasitic capacitance Radio frequency Transceivers TransferJet™ transceiver UWB wide bandwidth
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