Moisture diffusion and vapour pressure modeling of IC packaging

Moisture diffusion and vapour pressure modeling of IC packaging

A new physical quantity-wetness fraction-has been introduced to overcome the concentration discontinuity in the application of Fick's diffusion equation to multi-material systems such as in plastic IC packaging. This enables the use of commercial thermal diffusion software to model the transien...

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Hauptverfasser: Wong, Ee Hua, Teo, Yong Chua, Lim, Thiam Beng
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Sprache:eng
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Electronic packaging thermal management
Equations
Integrated circuit modeling
Integrated circuit packaging
Microelectronics
Moisture
Plastic packaging
Semiconductor device modeling
Temperature
Thermal stresses
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creator Wong, Ee Hua
Teo, Yong Chua
Lim, Thiam Beng
description A new physical quantity-wetness fraction-has been introduced to overcome the concentration discontinuity in the application of Fick's diffusion equation to multi-material systems such as in plastic IC packaging. This enables the use of commercial thermal diffusion software to model the transient moisture diffusion phenomenon in IC packaging. More significantly, the wetness fraction provides a simple means of computing the vapour pressure in a delaminated region within an IC package when it is heated up to 230/spl deg/C during reflow solder. The approach was bench marked against published works and found to corroborate remarkbly well despite its simplicity.
doi_str_mv 10.1109/ECTC.1998.678922
format Conference Proceeding
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identifier ISSN: 0569-5503
ispartof 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.1372-1378
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language eng
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Electronic packaging thermal management
Equations
Integrated circuit modeling
Integrated circuit packaging
Microelectronics
Moisture
Plastic packaging
Semiconductor device modeling
Temperature
Thermal stresses
title Moisture diffusion and vapour pressure modeling of IC packaging
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