Theoretical and experimental approach for model extraction of multiconductor interconnects with multiple meshed planes on an APCB

Multiple meshed power and ground planes are quite common in today's advanced PCB's (APCB's). The presence of meshed planes complicates the electrical modeling of interconnects in close proximity to these planes. In order to accurately model multiconductor interconnects near meshed pla...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Li, Y.L., Figueroa, D.G., Zhong, S., Nguyen, L.M., Nguyen, T., Polka, L.A., Liao, J.C.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 1067
container_issue
container_start_page 1061
container_title
container_volume
creator Li, Y.L.
Figueroa, D.G.
Zhong, S.
Nguyen, L.M.
Nguyen, T.
Polka, L.A.
Liao, J.C.
description Multiple meshed power and ground planes are quite common in today's advanced PCB's (APCB's). The presence of meshed planes complicates the electrical modeling of interconnects in close proximity to these planes. In order to accurately model multiconductor interconnects near meshed planes, a set of test coupons was characterized. The multiconductor interconnects were modeled as cascaded lossy transmission lines. The interconnect models were validated by performing time- and frequency-domain simulations to match TDR and S-parameter measurements. The validation results from both the time and frequency domains show good agreement between the measured and simulated data. Using the interconnect model developed from the characterization results of the first set of test coupons, crosstalk models were built for multiconductor interconnects with meshed planes. To validate the crosstalk models, a second set of test coupons was analyzed. The crosstalk at both ends of each structure was measured. The measured results were compared with results from simulations. Reasonable agreement was seen between measured and simulated results and the discrepancy is being investigated further.
doi_str_mv 10.1109/ECTC.1998.678845
format Conference Proceeding
fullrecord <record><control><sourceid>proquest_6IE</sourceid><recordid>TN_cdi_ieee_primary_678845</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>678845</ieee_id><sourcerecordid>26814341</sourcerecordid><originalsourceid>FETCH-LOGICAL-i203t-18bc032a1d0e31706143f6e97d9315904f1f41c6764f2b79fb2315d23a81d3c53</originalsourceid><addsrcrecordid>eNotUMlOwzAQtVgkqtI74uQTtxQv8XYsUVmkSnAo58h1xkpQNmJXwJE_x1UYjTSaN-89zQxCN5SsKSXmflvsizU1Rq-l0joXZ2jBuFKZUEyeo5VRmqTkuWCSX6AFEdJkQhB-hVYhfJAUuRCU6wX63dcwTBAbZ1ts-wrD9whT00EfT8A4ToN1NfbDhLuhgjbN42RdbIYeDx53xzZJh746upgoTR9hSm0PLgb81cR6Zowt4A5CDRUeW9tDwElue7x5Kx6u0aW3bYDVf12i98ftvnjOdq9PL8VmlzWM8JhRfXCEM0srApwqImnOvQSjKsOpMCT31OfUSSVzzw7K-ANLeMW41bTiTvAlupt900mfRwix7JrgoD3tMxxDyaROljlNxNuZ2ABAOaZn2OmnnB_N_wCqEnD6</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype><pqid>26814341</pqid></control><display><type>conference_proceeding</type><title>Theoretical and experimental approach for model extraction of multiconductor interconnects with multiple meshed planes on an APCB</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Li, Y.L. ; Figueroa, D.G. ; Zhong, S. ; Nguyen, L.M. ; Nguyen, T. ; Polka, L.A. ; Liao, J.C.</creator><creatorcontrib>Li, Y.L. ; Figueroa, D.G. ; Zhong, S. ; Nguyen, L.M. ; Nguyen, T. ; Polka, L.A. ; Liao, J.C.</creatorcontrib><description>Multiple meshed power and ground planes are quite common in today's advanced PCB's (APCB's). The presence of meshed planes complicates the electrical modeling of interconnects in close proximity to these planes. In order to accurately model multiconductor interconnects near meshed planes, a set of test coupons was characterized. The multiconductor interconnects were modeled as cascaded lossy transmission lines. The interconnect models were validated by performing time- and frequency-domain simulations to match TDR and S-parameter measurements. The validation results from both the time and frequency domains show good agreement between the measured and simulated data. Using the interconnect model developed from the characterization results of the first set of test coupons, crosstalk models were built for multiconductor interconnects with meshed planes. To validate the crosstalk models, a second set of test coupons was analyzed. The crosstalk at both ends of each structure was measured. The measured results were compared with results from simulations. Reasonable agreement was seen between measured and simulated results and the discrepancy is being investigated further.</description><identifier>ISSN: 0569-5503</identifier><identifier>ISBN: 9780780345263</identifier><identifier>ISBN: 0780345266</identifier><identifier>EISSN: 2377-5726</identifier><identifier>DOI: 10.1109/ECTC.1998.678845</identifier><language>eng</language><publisher>IEEE</publisher><subject>Crosstalk ; Frequency measurement ; Multiconductor transmission lines ; Performance evaluation ; Power transmission lines ; Propagation losses ; Scattering parameters ; Testing ; Transmission line measurements ; Transmission line theory</subject><ispartof>1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.1061-1067</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/678845$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,778,782,787,788,2054,4038,4039,27912,54907</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/678845$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Li, Y.L.</creatorcontrib><creatorcontrib>Figueroa, D.G.</creatorcontrib><creatorcontrib>Zhong, S.</creatorcontrib><creatorcontrib>Nguyen, L.M.</creatorcontrib><creatorcontrib>Nguyen, T.</creatorcontrib><creatorcontrib>Polka, L.A.</creatorcontrib><creatorcontrib>Liao, J.C.</creatorcontrib><title>Theoretical and experimental approach for model extraction of multiconductor interconnects with multiple meshed planes on an APCB</title><title>1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)</title><addtitle>ECTC</addtitle><description>Multiple meshed power and ground planes are quite common in today's advanced PCB's (APCB's). The presence of meshed planes complicates the electrical modeling of interconnects in close proximity to these planes. In order to accurately model multiconductor interconnects near meshed planes, a set of test coupons was characterized. The multiconductor interconnects were modeled as cascaded lossy transmission lines. The interconnect models were validated by performing time- and frequency-domain simulations to match TDR and S-parameter measurements. The validation results from both the time and frequency domains show good agreement between the measured and simulated data. Using the interconnect model developed from the characterization results of the first set of test coupons, crosstalk models were built for multiconductor interconnects with meshed planes. To validate the crosstalk models, a second set of test coupons was analyzed. The crosstalk at both ends of each structure was measured. The measured results were compared with results from simulations. Reasonable agreement was seen between measured and simulated results and the discrepancy is being investigated further.</description><subject>Crosstalk</subject><subject>Frequency measurement</subject><subject>Multiconductor transmission lines</subject><subject>Performance evaluation</subject><subject>Power transmission lines</subject><subject>Propagation losses</subject><subject>Scattering parameters</subject><subject>Testing</subject><subject>Transmission line measurements</subject><subject>Transmission line theory</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>9780780345263</isbn><isbn>0780345266</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>1998</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNotUMlOwzAQtVgkqtI74uQTtxQv8XYsUVmkSnAo58h1xkpQNmJXwJE_x1UYjTSaN-89zQxCN5SsKSXmflvsizU1Rq-l0joXZ2jBuFKZUEyeo5VRmqTkuWCSX6AFEdJkQhB-hVYhfJAUuRCU6wX63dcwTBAbZ1ts-wrD9whT00EfT8A4ToN1NfbDhLuhgjbN42RdbIYeDx53xzZJh746upgoTR9hSm0PLgb81cR6Zowt4A5CDRUeW9tDwElue7x5Kx6u0aW3bYDVf12i98ftvnjOdq9PL8VmlzWM8JhRfXCEM0srApwqImnOvQSjKsOpMCT31OfUSSVzzw7K-ANLeMW41bTiTvAlupt900mfRwix7JrgoD3tMxxDyaROljlNxNuZ2ABAOaZn2OmnnB_N_wCqEnD6</recordid><startdate>1998</startdate><enddate>1998</enddate><creator>Li, Y.L.</creator><creator>Figueroa, D.G.</creator><creator>Zhong, S.</creator><creator>Nguyen, L.M.</creator><creator>Nguyen, T.</creator><creator>Polka, L.A.</creator><creator>Liao, J.C.</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>1998</creationdate><title>Theoretical and experimental approach for model extraction of multiconductor interconnects with multiple meshed planes on an APCB</title><author>Li, Y.L. ; Figueroa, D.G. ; Zhong, S. ; Nguyen, L.M. ; Nguyen, T. ; Polka, L.A. ; Liao, J.C.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i203t-18bc032a1d0e31706143f6e97d9315904f1f41c6764f2b79fb2315d23a81d3c53</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>1998</creationdate><topic>Crosstalk</topic><topic>Frequency measurement</topic><topic>Multiconductor transmission lines</topic><topic>Performance evaluation</topic><topic>Power transmission lines</topic><topic>Propagation losses</topic><topic>Scattering parameters</topic><topic>Testing</topic><topic>Transmission line measurements</topic><topic>Transmission line theory</topic><toplevel>online_resources</toplevel><creatorcontrib>Li, Y.L.</creatorcontrib><creatorcontrib>Figueroa, D.G.</creatorcontrib><creatorcontrib>Zhong, S.</creatorcontrib><creatorcontrib>Nguyen, L.M.</creatorcontrib><creatorcontrib>Nguyen, T.</creatorcontrib><creatorcontrib>Polka, L.A.</creatorcontrib><creatorcontrib>Liao, J.C.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection><collection>Electronics &amp; Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Li, Y.L.</au><au>Figueroa, D.G.</au><au>Zhong, S.</au><au>Nguyen, L.M.</au><au>Nguyen, T.</au><au>Polka, L.A.</au><au>Liao, J.C.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Theoretical and experimental approach for model extraction of multiconductor interconnects with multiple meshed planes on an APCB</atitle><btitle>1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206)</btitle><stitle>ECTC</stitle><date>1998</date><risdate>1998</risdate><spage>1061</spage><epage>1067</epage><pages>1061-1067</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>9780780345263</isbn><isbn>0780345266</isbn><abstract>Multiple meshed power and ground planes are quite common in today's advanced PCB's (APCB's). The presence of meshed planes complicates the electrical modeling of interconnects in close proximity to these planes. In order to accurately model multiconductor interconnects near meshed planes, a set of test coupons was characterized. The multiconductor interconnects were modeled as cascaded lossy transmission lines. The interconnect models were validated by performing time- and frequency-domain simulations to match TDR and S-parameter measurements. The validation results from both the time and frequency domains show good agreement between the measured and simulated data. Using the interconnect model developed from the characterization results of the first set of test coupons, crosstalk models were built for multiconductor interconnects with meshed planes. To validate the crosstalk models, a second set of test coupons was analyzed. The crosstalk at both ends of each structure was measured. The measured results were compared with results from simulations. Reasonable agreement was seen between measured and simulated results and the discrepancy is being investigated further.</abstract><pub>IEEE</pub><doi>10.1109/ECTC.1998.678845</doi><tpages>7</tpages></addata></record>
fulltext fulltext_linktorsrc
identifier ISSN: 0569-5503
ispartof 1998 Proceedings. 48th Electronic Components and Technology Conference (Cat. No.98CH36206), 1998, p.1061-1067
issn 0569-5503
2377-5726
language eng
recordid cdi_ieee_primary_678845
source IEEE Electronic Library (IEL) Conference Proceedings
subjects Crosstalk
Frequency measurement
Multiconductor transmission lines
Performance evaluation
Power transmission lines
Propagation losses
Scattering parameters
Testing
Transmission line measurements
Transmission line theory
title Theoretical and experimental approach for model extraction of multiconductor interconnects with multiple meshed planes on an APCB
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-15T23%3A43%3A59IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Theoretical%20and%20experimental%20approach%20for%20model%20extraction%20of%20multiconductor%20interconnects%20with%20multiple%20meshed%20planes%20on%20an%20APCB&rft.btitle=1998%20Proceedings.%2048th%20Electronic%20Components%20and%20Technology%20Conference%20(Cat.%20No.98CH36206)&rft.au=Li,%20Y.L.&rft.date=1998&rft.spage=1061&rft.epage=1067&rft.pages=1061-1067&rft.issn=0569-5503&rft.eissn=2377-5726&rft.isbn=9780780345263&rft.isbn_list=0780345266&rft_id=info:doi/10.1109/ECTC.1998.678845&rft_dat=%3Cproquest_6IE%3E26814341%3C/proquest_6IE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=26814341&rft_id=info:pmid/&rft_ieee_id=678845&rfr_iscdi=true