MEMS packaging for micro mirror switches

A new packaging architecture is developed for the hybrid integration of free-space MOEMS (micro-opto-electro-mechanical systems) chip with a silicon micromachined submount. The submount is designed to accommodate various free-space MOEMS chips with minimal active optical alignment, thus reducing the...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Long-Sun Huang, Shi-Sheng Lee, Motamedi, E., Wu, M.C., Kim, C.-J.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Costs Geometrical optics Micromechanical devices Mirrors Optical design Optical fibers Optical switches Packaging Silicon Vibrations
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