Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect
The authors describe a new type of electronic packaging topology using embedded transmission-line (ETL) monolithic microwave integrated circuits (MMIC's) along with a new state-of-the-art Z-axis material that acts as a chip adhesive as well as an electrical connection with a carrier substrate....
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| Veröffentlicht in: | IEEE microwave and guided wave letters 1998-06, Vol.8 (6), p.238-240 |
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| container_end_page | 240 |
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| container_issue | 6 |
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| container_title | IEEE microwave and guided wave letters |
| container_volume | 8 |
| creator | Budka, T. Ketterson, A. Hua-Quen Tserng Stiborek, L. Heinrich, L. Smith, R. Ables, B. Kyhl, C. Worthen, K. Brehm, G. Reddick, J. |
| description | The authors describe a new type of electronic packaging topology using embedded transmission-line (ETL) monolithic microwave integrated circuits (MMIC's) along with a new state-of-the-art Z-axis material that acts as a chip adhesive as well as an electrical connection with a carrier substrate. The results from the first two flip chip assemblies that were produced under the Microwave Analog Front End Technology (MAFET) Thrust 2 Program are presented. The flip chip packages provided greater than 1-W package output power on a Kovar housing floor with greater than 8-dB package large signal gain at 11.5 GHz. |
| doi_str_mv | 10.1109/75.678578 |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_RIE</sourceid><recordid>TN_cdi_ieee_primary_678578</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>678578</ieee_id><sourcerecordid>26627998</sourcerecordid><originalsourceid>FETCH-LOGICAL-c266t-db6ec3b9f11ce4d10ee84270ddf98d75449b7d45b77acdcdb364c6185905fb003</originalsourceid><addsrcrecordid>eNo9kM1Lw0AQxRdRsFYPXj3tQQQPqbtJNrt7lFK10CKIIngJ-zHRlXzUTAr2v3dLipeZgfnNe8Mj5JKzGedM30kxK6QSUh2RCRdCJWmW6uM4M8ETlTJ5Ss4QvxnjucjYhLwsGgveg6dDb1psAmLoWlqHFuh6vZxTnrzTqg4b6r5iMYjQ2HpHtxjaT2roR2J-A9LQDtC7rm3BDefkpDI1wsWhT8nbw-J1_pSsnh-X8_tV4tKiGBJvC3CZ1RXnDnLPGYDKU8m8r7TyUuS5ttLnwkppnHfeZkXuCq6EZqKyjGVTcjPqbvruZws4lPF7B3VtWui2WEaXVGqtIng7gq7vEHuoyk0fGtPvSs7KfWqlFOWYWmSvD6IGnamrGIoL-H-QxgcF33tfjVgAgP_tQeMPUV1zsA</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>26627998</pqid></control><display><type>article</type><title>Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect</title><source>IEEE Electronic Library (IEL)</source><creator>Budka, T. ; Ketterson, A. ; Hua-Quen Tserng ; Stiborek, L. ; Heinrich, L. ; Smith, R. ; Ables, B. ; Kyhl, C. ; Worthen, K. ; Brehm, G. ; Reddick, J.</creator><creatorcontrib>Budka, T. ; Ketterson, A. ; Hua-Quen Tserng ; Stiborek, L. ; Heinrich, L. ; Smith, R. ; Ables, B. ; Kyhl, C. ; Worthen, K. ; Brehm, G. ; Reddick, J.</creatorcontrib><description>The authors describe a new type of electronic packaging topology using embedded transmission-line (ETL) monolithic microwave integrated circuits (MMIC's) along with a new state-of-the-art Z-axis material that acts as a chip adhesive as well as an electrical connection with a carrier substrate. The results from the first two flip chip assemblies that were produced under the Microwave Analog Front End Technology (MAFET) Thrust 2 Program are presented. The flip chip packages provided greater than 1-W package output power on a Kovar housing floor with greater than 8-dB package large signal gain at 11.5 GHz.</description><identifier>ISSN: 1051-8207</identifier><identifier>EISSN: 1558-2329</identifier><identifier>DOI: 10.1109/75.678578</identifier><identifier>CODEN: IMGLE3</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Assembly ; Circuit properties ; Circuit topology ; Distributed parameter circuits ; Electric, optical and optoelectronic circuits ; Electronics ; Electronics packaging ; Exact sciences and technology ; Flip chip ; Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits ; Microwave integrated circuits ; MMICs ; Monolithic integrated circuits ; Power transmission lines ; Transmission lines</subject><ispartof>IEEE microwave and guided wave letters, 1998-06, Vol.8 (6), p.238-240</ispartof><rights>1998 INIST-CNRS</rights><woscitedreferencessubscribed>false</woscitedreferencessubscribed><cites>FETCH-LOGICAL-c266t-db6ec3b9f11ce4d10ee84270ddf98d75449b7d45b77acdcdb364c6185905fb003</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/678578$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/678578$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=2270510$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>Budka, T.</creatorcontrib><creatorcontrib>Ketterson, A.</creatorcontrib><creatorcontrib>Hua-Quen Tserng</creatorcontrib><creatorcontrib>Stiborek, L.</creatorcontrib><creatorcontrib>Heinrich, L.</creatorcontrib><creatorcontrib>Smith, R.</creatorcontrib><creatorcontrib>Ables, B.</creatorcontrib><creatorcontrib>Kyhl, C.</creatorcontrib><creatorcontrib>Worthen, K.</creatorcontrib><creatorcontrib>Brehm, G.</creatorcontrib><creatorcontrib>Reddick, J.</creatorcontrib><title>Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect</title><title>IEEE microwave and guided wave letters</title><addtitle>MGWL</addtitle><description>The authors describe a new type of electronic packaging topology using embedded transmission-line (ETL) monolithic microwave integrated circuits (MMIC's) along with a new state-of-the-art Z-axis material that acts as a chip adhesive as well as an electrical connection with a carrier substrate. The results from the first two flip chip assemblies that were produced under the Microwave Analog Front End Technology (MAFET) Thrust 2 Program are presented. The flip chip packages provided greater than 1-W package output power on a Kovar housing floor with greater than 8-dB package large signal gain at 11.5 GHz.</description><subject>Applied sciences</subject><subject>Assembly</subject><subject>Circuit properties</subject><subject>Circuit topology</subject><subject>Distributed parameter circuits</subject><subject>Electric, optical and optoelectronic circuits</subject><subject>Electronics</subject><subject>Electronics packaging</subject><subject>Exact sciences and technology</subject><subject>Flip chip</subject><subject>Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits</subject><subject>Microwave integrated circuits</subject><subject>MMICs</subject><subject>Monolithic integrated circuits</subject><subject>Power transmission lines</subject><subject>Transmission lines</subject><issn>1051-8207</issn><issn>1558-2329</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>1998</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kM1Lw0AQxRdRsFYPXj3tQQQPqbtJNrt7lFK10CKIIngJ-zHRlXzUTAr2v3dLipeZgfnNe8Mj5JKzGedM30kxK6QSUh2RCRdCJWmW6uM4M8ETlTJ5Ss4QvxnjucjYhLwsGgveg6dDb1psAmLoWlqHFuh6vZxTnrzTqg4b6r5iMYjQ2HpHtxjaT2roR2J-A9LQDtC7rm3BDefkpDI1wsWhT8nbw-J1_pSsnh-X8_tV4tKiGBJvC3CZ1RXnDnLPGYDKU8m8r7TyUuS5ttLnwkppnHfeZkXuCq6EZqKyjGVTcjPqbvruZws4lPF7B3VtWui2WEaXVGqtIng7gq7vEHuoyk0fGtPvSs7KfWqlFOWYWmSvD6IGnamrGIoL-H-QxgcF33tfjVgAgP_tQeMPUV1zsA</recordid><startdate>19980601</startdate><enddate>19980601</enddate><creator>Budka, T.</creator><creator>Ketterson, A.</creator><creator>Hua-Quen Tserng</creator><creator>Stiborek, L.</creator><creator>Heinrich, L.</creator><creator>Smith, R.</creator><creator>Ables, B.</creator><creator>Kyhl, C.</creator><creator>Worthen, K.</creator><creator>Brehm, G.</creator><creator>Reddick, J.</creator><general>IEEE</general><general>Institute of Electrical and Electronics Engineers</general><scope>RIA</scope><scope>RIE</scope><scope>IQODW</scope><scope>AAYXX</scope><scope>CITATION</scope><scope>8FD</scope><scope>H8D</scope><scope>L7M</scope></search><sort><creationdate>19980601</creationdate><title>Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect</title><author>Budka, T. ; Ketterson, A. ; Hua-Quen Tserng ; Stiborek, L. ; Heinrich, L. ; Smith, R. ; Ables, B. ; Kyhl, C. ; Worthen, K. ; Brehm, G. ; Reddick, J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c266t-db6ec3b9f11ce4d10ee84270ddf98d75449b7d45b77acdcdb364c6185905fb003</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>1998</creationdate><topic>Applied sciences</topic><topic>Assembly</topic><topic>Circuit properties</topic><topic>Circuit topology</topic><topic>Distributed parameter circuits</topic><topic>Electric, optical and optoelectronic circuits</topic><topic>Electronics</topic><topic>Electronics packaging</topic><topic>Exact sciences and technology</topic><topic>Flip chip</topic><topic>Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits</topic><topic>Microwave integrated circuits</topic><topic>MMICs</topic><topic>Monolithic integrated circuits</topic><topic>Power transmission lines</topic><topic>Transmission lines</topic><toplevel>online_resources</toplevel><creatorcontrib>Budka, T.</creatorcontrib><creatorcontrib>Ketterson, A.</creatorcontrib><creatorcontrib>Hua-Quen Tserng</creatorcontrib><creatorcontrib>Stiborek, L.</creatorcontrib><creatorcontrib>Heinrich, L.</creatorcontrib><creatorcontrib>Smith, R.</creatorcontrib><creatorcontrib>Ables, B.</creatorcontrib><creatorcontrib>Kyhl, C.</creatorcontrib><creatorcontrib>Worthen, K.</creatorcontrib><creatorcontrib>Brehm, G.</creatorcontrib><creatorcontrib>Reddick, J.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><collection>Technology Research Database</collection><collection>Aerospace Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>IEEE microwave and guided wave letters</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Budka, T.</au><au>Ketterson, A.</au><au>Hua-Quen Tserng</au><au>Stiborek, L.</au><au>Heinrich, L.</au><au>Smith, R.</au><au>Ables, B.</au><au>Kyhl, C.</au><au>Worthen, K.</au><au>Brehm, G.</au><au>Reddick, J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect</atitle><jtitle>IEEE microwave and guided wave letters</jtitle><stitle>MGWL</stitle><date>1998-06-01</date><risdate>1998</risdate><volume>8</volume><issue>6</issue><spage>238</spage><epage>240</epage><pages>238-240</pages><issn>1051-8207</issn><eissn>1558-2329</eissn><coden>IMGLE3</coden><abstract>The authors describe a new type of electronic packaging topology using embedded transmission-line (ETL) monolithic microwave integrated circuits (MMIC's) along with a new state-of-the-art Z-axis material that acts as a chip adhesive as well as an electrical connection with a carrier substrate. The results from the first two flip chip assemblies that were produced under the Microwave Analog Front End Technology (MAFET) Thrust 2 Program are presented. The flip chip packages provided greater than 1-W package output power on a Kovar housing floor with greater than 8-dB package large signal gain at 11.5 GHz.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/75.678578</doi><tpages>3</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 1051-8207 |
| ispartof | IEEE microwave and guided wave letters, 1998-06, Vol.8 (6), p.238-240 |
| issn | 1051-8207 1558-2329 |
| language | eng |
| recordid | cdi_ieee_primary_678578 |
| source | IEEE Electronic Library (IEL) |
| subjects | Applied sciences Assembly Circuit properties Circuit topology Distributed parameter circuits Electric, optical and optoelectronic circuits Electronics Electronics packaging Exact sciences and technology Flip chip Microwave circuits, microwave integrated circuits, microwave transmission lines, submillimeter wave circuits Microwave integrated circuits MMICs Monolithic integrated circuits Power transmission lines Transmission lines |
| title | Embedded transmission line MMIC 1-W flip chip assembly using a Z-axis interconnect |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-05T20%3A24%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Embedded%20transmission%20line%20MMIC%201-W%20flip%20chip%20assembly%20using%20a%20Z-axis%20interconnect&rft.jtitle=IEEE%20microwave%20and%20guided%20wave%20letters&rft.au=Budka,%20T.&rft.date=1998-06-01&rft.volume=8&rft.issue=6&rft.spage=238&rft.epage=240&rft.pages=238-240&rft.issn=1051-8207&rft.eissn=1558-2329&rft.coden=IMGLE3&rft_id=info:doi/10.1109/75.678578&rft_dat=%3Cproquest_RIE%3E26627998%3C/proquest_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=26627998&rft_id=info:pmid/&rft_ieee_id=678578&rfr_iscdi=true |