6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters

Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing...

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Hauptverfasser: Erdmann, Christophe, Lowney, Donnacha, Lynam, Adrian, Keady, Aidan, McGrath, John, Cullen, Edward, Breathnach, Daire, Keane, Denis, Lynch, Patrick, De La Torre, Marites, De La Torre, Ronnie, Peng Lim, Collins, Anthony, Farley, Brendan, Madden, Liam
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creator Erdmann, Christophe
Lowney, Donnacha
Lynam, Adrian
Keady, Aidan
McGrath, John
Cullen, Edward
Breathnach, Daire
Keane, Denis
Lynch, Patrick
De La Torre, Marites
De La Torre, Ronnie
Peng Lim
Collins, Anthony
Farley, Brendan
Madden, Liam
description Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing channel count and higher sample rate means this IO interface is becoming a limiting factor in the system budget with respect to interconnect complexity and associated power. The integration of flexible data converters with FPGA eliminates this IO cost and also offers a dynamically scalable, power efficient platform solution that addresses diverse application needs. In this paper, we demonstrate an aggregate bandwidth in excess of 400Gb/s using sixteen 16b DAC instances running at 1.6GS/s with an FPGA-to-die interface power of 0.3mW/Gb/s. We introduce a reconfigurable receive system that allows channel count to trade with system sample rate. Specifically, we demonstrate a 500MS/s ADC by interleaving four 125MS/s units.
doi_str_mv 10.1109/ISSCC.2014.6757364
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identifier ISSN: 0193-6530
ispartof 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014, p.120-121
issn 0193-6530
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Arrays
Bandwidth
Clocks
CMOS integrated circuits
Field programmable gate arrays
Frequency measurement
Integrated circuit interconnections
title 6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters
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