6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters
Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing...
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creator | Erdmann, Christophe Lowney, Donnacha Lynam, Adrian Keady, Aidan McGrath, John Cullen, Edward Breathnach, Daire Keane, Denis Lynch, Patrick De La Torre, Marites De La Torre, Ronnie Peng Lim Collins, Anthony Farley, Brendan Madden, Liam |
description | Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing channel count and higher sample rate means this IO interface is becoming a limiting factor in the system budget with respect to interconnect complexity and associated power. The integration of flexible data converters with FPGA eliminates this IO cost and also offers a dynamically scalable, power efficient platform solution that addresses diverse application needs. In this paper, we demonstrate an aggregate bandwidth in excess of 400Gb/s using sixteen 16b DAC instances running at 1.6GS/s with an FPGA-to-die interface power of 0.3mW/Gb/s. We introduce a reconfigurable receive system that allows channel count to trade with system sample rate. Specifically, we demonstrate a 500MS/s ADC by interleaving four 125MS/s units. |
doi_str_mv | 10.1109/ISSCC.2014.6757364 |
format | Conference Proceeding |
fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6757364</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6757364</ieee_id><sourcerecordid>6757364</sourcerecordid><originalsourceid>FETCH-ieee_primary_67573643</originalsourceid><addsrcrecordid>eNp9j8tOwzAURM1LIoX-AGzuDyS9jhM7XlaB0u6Q2n1lmpvUqLEjOwXx9xQpa1azOKMzGsaeOGaco15sttu6znLkRSZVqYQsrthcq4oXSmvUOeprluRCybSSKG_YbAK84rcsQa5FKkuB92wW4ycillpWCRtkJmAJaxop-I4c-XME8ZJuajh4F20crevAtzB-e8gr18Pq_W0JjSUwrgGRQ6BLsbXdOZiPE8HRdsd0oND60Bt3IGjMaP5cXxQuG_GR3bXmFGk-5QN7Xr3u6nVqiWg_BNub8LOfHor_6S8u_U45</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Erdmann, Christophe ; Lowney, Donnacha ; Lynam, Adrian ; Keady, Aidan ; McGrath, John ; Cullen, Edward ; Breathnach, Daire ; Keane, Denis ; Lynch, Patrick ; De La Torre, Marites ; De La Torre, Ronnie ; Peng Lim ; Collins, Anthony ; Farley, Brendan ; Madden, Liam</creator><creatorcontrib>Erdmann, Christophe ; Lowney, Donnacha ; Lynam, Adrian ; Keady, Aidan ; McGrath, John ; Cullen, Edward ; Breathnach, Daire ; Keane, Denis ; Lynch, Patrick ; De La Torre, Marites ; De La Torre, Ronnie ; Peng Lim ; Collins, Anthony ; Farley, Brendan ; Madden, Liam</creatorcontrib><description>Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing channel count and higher sample rate means this IO interface is becoming a limiting factor in the system budget with respect to interconnect complexity and associated power. The integration of flexible data converters with FPGA eliminates this IO cost and also offers a dynamically scalable, power efficient platform solution that addresses diverse application needs. In this paper, we demonstrate an aggregate bandwidth in excess of 400Gb/s using sixteen 16b DAC instances running at 1.6GS/s with an FPGA-to-die interface power of 0.3mW/Gb/s. We introduce a reconfigurable receive system that allows channel count to trade with system sample rate. Specifically, we demonstrate a 500MS/s ADC by interleaving four 125MS/s units.</description><identifier>ISSN: 0193-6530</identifier><identifier>ISBN: 1479909181</identifier><identifier>ISBN: 9781479909186</identifier><identifier>EISSN: 2376-8606</identifier><identifier>EISBN: 9781479909209</identifier><identifier>EISBN: 1479909203</identifier><identifier>DOI: 10.1109/ISSCC.2014.6757364</identifier><language>eng</language><publisher>IEEE</publisher><subject>Arrays ; Bandwidth ; Clocks ; CMOS integrated circuits ; Field programmable gate arrays ; Frequency measurement ; Integrated circuit interconnections</subject><ispartof>2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014, p.120-121</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6757364$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2052,27902,54895</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6757364$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Erdmann, Christophe</creatorcontrib><creatorcontrib>Lowney, Donnacha</creatorcontrib><creatorcontrib>Lynam, Adrian</creatorcontrib><creatorcontrib>Keady, Aidan</creatorcontrib><creatorcontrib>McGrath, John</creatorcontrib><creatorcontrib>Cullen, Edward</creatorcontrib><creatorcontrib>Breathnach, Daire</creatorcontrib><creatorcontrib>Keane, Denis</creatorcontrib><creatorcontrib>Lynch, Patrick</creatorcontrib><creatorcontrib>De La Torre, Marites</creatorcontrib><creatorcontrib>De La Torre, Ronnie</creatorcontrib><creatorcontrib>Peng Lim</creatorcontrib><creatorcontrib>Collins, Anthony</creatorcontrib><creatorcontrib>Farley, Brendan</creatorcontrib><creatorcontrib>Madden, Liam</creatorcontrib><title>6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters</title><title>2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC)</title><addtitle>ISSCC</addtitle><description>Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing channel count and higher sample rate means this IO interface is becoming a limiting factor in the system budget with respect to interconnect complexity and associated power. The integration of flexible data converters with FPGA eliminates this IO cost and also offers a dynamically scalable, power efficient platform solution that addresses diverse application needs. In this paper, we demonstrate an aggregate bandwidth in excess of 400Gb/s using sixteen 16b DAC instances running at 1.6GS/s with an FPGA-to-die interface power of 0.3mW/Gb/s. We introduce a reconfigurable receive system that allows channel count to trade with system sample rate. Specifically, we demonstrate a 500MS/s ADC by interleaving four 125MS/s units.</description><subject>Arrays</subject><subject>Bandwidth</subject><subject>Clocks</subject><subject>CMOS integrated circuits</subject><subject>Field programmable gate arrays</subject><subject>Frequency measurement</subject><subject>Integrated circuit interconnections</subject><issn>0193-6530</issn><issn>2376-8606</issn><isbn>1479909181</isbn><isbn>9781479909186</isbn><isbn>9781479909209</isbn><isbn>1479909203</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2014</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNp9j8tOwzAURM1LIoX-AGzuDyS9jhM7XlaB0u6Q2n1lmpvUqLEjOwXx9xQpa1azOKMzGsaeOGaco15sttu6znLkRSZVqYQsrthcq4oXSmvUOeprluRCybSSKG_YbAK84rcsQa5FKkuB92wW4ycillpWCRtkJmAJaxop-I4c-XME8ZJuajh4F20crevAtzB-e8gr18Pq_W0JjSUwrgGRQ6BLsbXdOZiPE8HRdsd0oND60Bt3IGjMaP5cXxQuG_GR3bXmFGk-5QN7Xr3u6nVqiWg_BNub8LOfHor_6S8u_U45</recordid><startdate>201402</startdate><enddate>201402</enddate><creator>Erdmann, Christophe</creator><creator>Lowney, Donnacha</creator><creator>Lynam, Adrian</creator><creator>Keady, Aidan</creator><creator>McGrath, John</creator><creator>Cullen, Edward</creator><creator>Breathnach, Daire</creator><creator>Keane, Denis</creator><creator>Lynch, Patrick</creator><creator>De La Torre, Marites</creator><creator>De La Torre, Ronnie</creator><creator>Peng Lim</creator><creator>Collins, Anthony</creator><creator>Farley, Brendan</creator><creator>Madden, Liam</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>201402</creationdate><title>6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters</title><author>Erdmann, Christophe ; Lowney, Donnacha ; Lynam, Adrian ; Keady, Aidan ; McGrath, John ; Cullen, Edward ; Breathnach, Daire ; Keane, Denis ; Lynch, Patrick ; De La Torre, Marites ; De La Torre, Ronnie ; Peng Lim ; Collins, Anthony ; Farley, Brendan ; Madden, Liam</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-ieee_primary_67573643</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2014</creationdate><topic>Arrays</topic><topic>Bandwidth</topic><topic>Clocks</topic><topic>CMOS integrated circuits</topic><topic>Field programmable gate arrays</topic><topic>Frequency measurement</topic><topic>Integrated circuit interconnections</topic><toplevel>online_resources</toplevel><creatorcontrib>Erdmann, Christophe</creatorcontrib><creatorcontrib>Lowney, Donnacha</creatorcontrib><creatorcontrib>Lynam, Adrian</creatorcontrib><creatorcontrib>Keady, Aidan</creatorcontrib><creatorcontrib>McGrath, John</creatorcontrib><creatorcontrib>Cullen, Edward</creatorcontrib><creatorcontrib>Breathnach, Daire</creatorcontrib><creatorcontrib>Keane, Denis</creatorcontrib><creatorcontrib>Lynch, Patrick</creatorcontrib><creatorcontrib>De La Torre, Marites</creatorcontrib><creatorcontrib>De La Torre, Ronnie</creatorcontrib><creatorcontrib>Peng Lim</creatorcontrib><creatorcontrib>Collins, Anthony</creatorcontrib><creatorcontrib>Farley, Brendan</creatorcontrib><creatorcontrib>Madden, Liam</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Erdmann, Christophe</au><au>Lowney, Donnacha</au><au>Lynam, Adrian</au><au>Keady, Aidan</au><au>McGrath, John</au><au>Cullen, Edward</au><au>Breathnach, Daire</au><au>Keane, Denis</au><au>Lynch, Patrick</au><au>De La Torre, Marites</au><au>De La Torre, Ronnie</au><au>Peng Lim</au><au>Collins, Anthony</au><au>Farley, Brendan</au><au>Madden, Liam</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters</atitle><btitle>2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC)</btitle><stitle>ISSCC</stitle><date>2014-02</date><risdate>2014</risdate><spage>120</spage><epage>121</epage><pages>120-121</pages><issn>0193-6530</issn><eissn>2376-8606</eissn><isbn>1479909181</isbn><isbn>9781479909186</isbn><eisbn>9781479909209</eisbn><eisbn>1479909203</eisbn><abstract>Data converters are required to interface digital processing engines, for example FPGAs, to the real world. Data conversion is typically accomplished using discrete devices that are interfaced to the FPGA using various IO standards. However, exponential growth in bandwidth as a result of increasing channel count and higher sample rate means this IO interface is becoming a limiting factor in the system budget with respect to interconnect complexity and associated power. The integration of flexible data converters with FPGA eliminates this IO cost and also offers a dynamically scalable, power efficient platform solution that addresses diverse application needs. In this paper, we demonstrate an aggregate bandwidth in excess of 400Gb/s using sixteen 16b DAC instances running at 1.6GS/s with an FPGA-to-die interface power of 0.3mW/Gb/s. We introduce a reconfigurable receive system that allows channel count to trade with system sample rate. Specifically, we demonstrate a 500MS/s ADC by interleaving four 125MS/s units.</abstract><pub>IEEE</pub><doi>10.1109/ISSCC.2014.6757364</doi></addata></record> |
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identifier | ISSN: 0193-6530 |
ispartof | 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC), 2014, p.120-121 |
issn | 0193-6530 2376-8606 |
language | eng |
recordid | cdi_ieee_primary_6757364 |
source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Arrays Bandwidth Clocks CMOS integrated circuits Field programmable gate arrays Frequency measurement Integrated circuit interconnections |
title | 6.3 A Heterogeneous 3D-IC consisting of two 28nm FPGA die and 32 reconfigurable high-performance data converters |
url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-12T15%3A42%3A21IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=6.3%20A%20Heterogeneous%203D-IC%20consisting%20of%20two%2028nm%20FPGA%20die%20and%2032%20reconfigurable%20high-performance%20data%20converters&rft.btitle=2014%20IEEE%20International%20Solid-State%20Circuits%20Conference%20Digest%20of%20Technical%20Papers%20(ISSCC)&rft.au=Erdmann,%20Christophe&rft.date=2014-02&rft.spage=120&rft.epage=121&rft.pages=120-121&rft.issn=0193-6530&rft.eissn=2376-8606&rft.isbn=1479909181&rft.isbn_list=9781479909186&rft_id=info:doi/10.1109/ISSCC.2014.6757364&rft_dat=%3Cieee_6IE%3E6757364%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=9781479909209&rft.eisbn_list=1479909203&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6757364&rfr_iscdi=true |