Multichip packaging in QFPs by PBO-multilayer high density interconnect

Multichip packaging in QFPs by PBO-multilayer high density interconnect

Further development of the HDP market will be determined primarily by the cost and availability of high density packaging alternatives such as multichip packages (MCP), fine pitch surface mount devices (SMD with pitch

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Bibliographische Detailangaben
Hauptverfasser: Ammann, N., Helder, H.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Adhesives
Assembly systems
Availability
Ceramics
Chip scale packaging
Cost function
Dielectric substrates
Electronics packaging
Flip chip
Nonhomogeneous media
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Beschreibung
Zusammenfassung:Further development of the HDP market will be determined primarily by the cost and availability of high density packaging alternatives such as multichip packages (MCP), fine pitch surface mount devices (SMD with pitch
DOI:10.1109/ICMCM.1998.670750