WiFi SiP module using IPD Rx Balun applications

A compact WiFi SiP module using IPD (Integrated Passive Device) Rx Balun is proposed. This WiFi SiP module integrates active chip, RF front end circuit, EEPROM and IPD chip as a full system module that can be easily used for 802.11g WLAN application, especially in handheld products like note book or...

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Hauptverfasser:	Min-Han Chuang, Chia-Chu Lai, Ho-Chuan Lin, Ming-Fan Tsai, Chen, Camus, Yang, Erico, Lee, Daniel
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Capacitors IEEE 802.11 Standards Impedance matching Inductors Radio frequency Silicon Topology
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creator	Min-Han Chuang Chia-Chu Lai Ho-Chuan Lin Ming-Fan Tsai Chen, Camus Yang, Erico Lee, Daniel
description	A compact WiFi SiP module using IPD (Integrated Passive Device) Rx Balun is proposed. This WiFi SiP module integrates active chip, RF front end circuit, EEPROM and IPD chip as a full system module that can be easily used for 802.11g WLAN application, especially in handheld products like note book or cell phone. The IPD Rx Balun is designed on a silicon substrate, and soldered on substrate with WiFi chip. The IPD Rx Balun is fabricated on a silicon substrate using thin film process to build up low cost, high performance, and high quality passive component of capacitors, and inductors. Two designs of IPD Rx Balun to meet the WiFi module requirement are presented. Their dimensions are all 1.0×0.895×0.5 mm 3 (LxWxH). The simulation results show that the baluns achieves 1.0 dB insertion loss and -15 dB return loss between the 2.4-2.5 GHz operation bandwidth. The phase and amplitude imbalances are less than 10° and 2 dB, respectively. Eventually, this SiP module receiving sensitivity is about -73 dBm at 54Mbps data rate, and meet 802.11g spec.
doi_str_mv	10.1109/IMPACT.2013.6706641
format	Conference Proceeding
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This WiFi SiP module integrates active chip, RF front end circuit, EEPROM and IPD chip as a full system module that can be easily used for 802.11g WLAN application, especially in handheld products like note book or cell phone. The IPD Rx Balun is designed on a silicon substrate, and soldered on substrate with WiFi chip. The IPD Rx Balun is fabricated on a silicon substrate using thin film process to build up low cost, high performance, and high quality passive component of capacitors, and inductors. Two designs of IPD Rx Balun to meet the WiFi module requirement are presented. Their dimensions are all 1.0×0.895×0.5 mm 3 (LxWxH). The simulation results show that the baluns achieves 1.0 dB insertion loss and -15 dB return loss between the 2.4-2.5 GHz operation bandwidth. The phase and amplitude imbalances are less than 10° and 2 dB, respectively. 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subjects	Capacitors IEEE 802.11 Standards Impedance matching Inductors Radio frequency Silicon Topology
title	WiFi SiP module using IPD Rx Balun applications
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