Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet

Solder balls are used for electric connections in various electric devices. Since the electric devices have been widely used for automobiles, airplanes, electric home appliances, personal digital assistances besides conventional computers, their reliability under various conditions including humid a...

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description Solder balls are used for electric connections in various electric devices. Since the electric devices have been widely used for automobiles, airplanes, electric home appliances, personal digital assistances besides conventional computers, their reliability under various conditions including humid and corrosive environments has to be evaluated. The authors proposed a non-contact tensile test method using permanent magnet and applied it to the solder joint testings. As the tensile force is remotely given to the solder joint, it becomes possible to isolate solder joint from gripping jig and set the joint in a liquid container. In this paper, tensile tests of copper-cored lead-free solder joint are carried out both in air and in water conditions, and the results on joint strength are discussed.
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fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6706624</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6706624</ieee_id><sourcerecordid>6706624</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-8c6a94a47a357185afe632fd44961aa919468bfb52cadc14a71fffd9b566a3603</originalsourceid><addsrcrecordid>eNo9UEtPAjEYrEYTEfkFXPoHFvsuPRLigwSjMXgmZfsVS7pbbMuBf-8mEk8zk3kcBqEpJTNKiXlcvX0slpsZI5TPlCZKMXGF7qnQxgxCk2s0YlSSRhrBbv45F3doUsqBEEK1ZlqIEfr-hC5ViOemTX3NKUZwuEJfQoQBS8XJ4zYdj5CHRB7MCNY1PgPgkqKDjA8p9BWHHsfwcwoOn0ro93godLaHwensvof6gG69jQUmFxyjr-enzfK1Wb-_rJaLdROolrWZt8oaYYW2XGo6l9aD4sw7IYyi1hpqhJrv_E6y1rqWCqup996ZnVTKckX4GE3_dgMAbI85dDaft5eT-C8tfFuY</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Tada, Naoya ; Masago, Hiroyasu</creator><creatorcontrib>Tada, Naoya ; Masago, Hiroyasu</creatorcontrib><description>Solder balls are used for electric connections in various electric devices. Since the electric devices have been widely used for automobiles, airplanes, electric home appliances, personal digital assistances besides conventional computers, their reliability under various conditions including humid and corrosive environments has to be evaluated. The authors proposed a non-contact tensile test method using permanent magnet and applied it to the solder joint testings. As the tensile force is remotely given to the solder joint, it becomes possible to isolate solder joint from gripping jig and set the joint in a liquid container. In this paper, tensile tests of copper-cored lead-free solder joint are carried out both in air and in water conditions, and the results on joint strength are discussed.</description><identifier>ISSN: 2150-5934</identifier><identifier>EISSN: 2150-5942</identifier><identifier>EISBN: 1479906670</identifier><identifier>EISBN: 9781479906673</identifier><identifier>DOI: 10.1109/IMPACT.2013.6706624</identifier><language>eng</language><publisher>IEEE</publisher><subject>Fixtures ; Lead ; Magnetic forces ; Nickel ; Reliability ; Soldering ; Testing</subject><ispartof>2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013, p.186-189</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6706624$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2051,27904,54898</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6706624$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Tada, Naoya</creatorcontrib><creatorcontrib>Masago, Hiroyasu</creatorcontrib><title>Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet</title><title>2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</title><addtitle>IMPACT</addtitle><description>Solder balls are used for electric connections in various electric devices. Since the electric devices have been widely used for automobiles, airplanes, electric home appliances, personal digital assistances besides conventional computers, their reliability under various conditions including humid and corrosive environments has to be evaluated. The authors proposed a non-contact tensile test method using permanent magnet and applied it to the solder joint testings. As the tensile force is remotely given to the solder joint, it becomes possible to isolate solder joint from gripping jig and set the joint in a liquid container. In this paper, tensile tests of copper-cored lead-free solder joint are carried out both in air and in water conditions, and the results on joint strength are discussed.</description><subject>Fixtures</subject><subject>Lead</subject><subject>Magnetic forces</subject><subject>Nickel</subject><subject>Reliability</subject><subject>Soldering</subject><subject>Testing</subject><issn>2150-5934</issn><issn>2150-5942</issn><isbn>1479906670</isbn><isbn>9781479906673</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2013</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo9UEtPAjEYrEYTEfkFXPoHFvsuPRLigwSjMXgmZfsVS7pbbMuBf-8mEk8zk3kcBqEpJTNKiXlcvX0slpsZI5TPlCZKMXGF7qnQxgxCk2s0YlSSRhrBbv45F3doUsqBEEK1ZlqIEfr-hC5ViOemTX3NKUZwuEJfQoQBS8XJ4zYdj5CHRB7MCNY1PgPgkqKDjA8p9BWHHsfwcwoOn0ro93godLaHwensvof6gG69jQUmFxyjr-enzfK1Wb-_rJaLdROolrWZt8oaYYW2XGo6l9aD4sw7IYyi1hpqhJrv_E6y1rqWCqup996ZnVTKckX4GE3_dgMAbI85dDaft5eT-C8tfFuY</recordid><startdate>201310</startdate><enddate>201310</enddate><creator>Tada, Naoya</creator><creator>Masago, Hiroyasu</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201310</creationdate><title>Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet</title><author>Tada, Naoya ; Masago, Hiroyasu</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-8c6a94a47a357185afe632fd44961aa919468bfb52cadc14a71fffd9b566a3603</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Fixtures</topic><topic>Lead</topic><topic>Magnetic forces</topic><topic>Nickel</topic><topic>Reliability</topic><topic>Soldering</topic><topic>Testing</topic><toplevel>online_resources</toplevel><creatorcontrib>Tada, Naoya</creatorcontrib><creatorcontrib>Masago, Hiroyasu</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tada, Naoya</au><au>Masago, Hiroyasu</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet</atitle><btitle>2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</btitle><stitle>IMPACT</stitle><date>2013-10</date><risdate>2013</risdate><spage>186</spage><epage>189</epage><pages>186-189</pages><issn>2150-5934</issn><eissn>2150-5942</eissn><eisbn>1479906670</eisbn><eisbn>9781479906673</eisbn><abstract>Solder balls are used for electric connections in various electric devices. Since the electric devices have been widely used for automobiles, airplanes, electric home appliances, personal digital assistances besides conventional computers, their reliability under various conditions including humid and corrosive environments has to be evaluated. The authors proposed a non-contact tensile test method using permanent magnet and applied it to the solder joint testings. As the tensile force is remotely given to the solder joint, it becomes possible to isolate solder joint from gripping jig and set the joint in a liquid container. In this paper, tensile tests of copper-cored lead-free solder joint are carried out both in air and in water conditions, and the results on joint strength are discussed.</abstract><pub>IEEE</pub><doi>10.1109/IMPACT.2013.6706624</doi><tpages>4</tpages></addata></record>
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identifier ISSN: 2150-5934
ispartof 2013 8th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2013, p.186-189
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2150-5942
language eng
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Fixtures
Lead
Magnetic forces
Nickel
Reliability
Soldering
Testing
title Remotely-controlled tensile test of copper-cored lead-free solder joint in liquid using permanent magnet
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T23%3A01%3A14IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Remotely-controlled%20tensile%20test%20of%20copper-cored%20lead-free%20solder%20joint%20in%20liquid%20using%20permanent%20magnet&rft.btitle=2013%208th%20International%20Microsystems,%20Packaging,%20Assembly%20and%20Circuits%20Technology%20Conference%20(IMPACT)&rft.au=Tada,%20Naoya&rft.date=2013-10&rft.spage=186&rft.epage=189&rft.pages=186-189&rft.issn=2150-5934&rft.eissn=2150-5942&rft_id=info:doi/10.1109/IMPACT.2013.6706624&rft_dat=%3Cieee_6IE%3E6706624%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1479906670&rft.eisbn_list=9781479906673&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6706624&rfr_iscdi=true