Embedded wafer level ball grid array (eWLB) technology for high-frequency system-in-package applications

The embedded wafer level ball grid array (eWLB) is a novel system integration platform introduced recently. The eWLB technology is an attractive solution for high-frequency system-in-package (SiP) integration due to the capability to design high-quality (high-Q) embedded passives in the fan-out regi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Wojnowski, Maciej, Pressel, Klaus
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Coils Dipole antennas High-frequency measurements Inductors Oil insulation packaging passive circuits Solenoids thin-film inductors Three-dimensional displays wafer-scale integration
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