77-GHz Automotive Radar Sensor System With Antenna Integrated Package

In this paper, a 3-D integrated 77-GHz automotive radar front-end is presented. Embedded wafer level packaging (EMWLP) technology is proposed to eliminate the use of wire bonding, which not only introduces significant radio frequency loss, but also occupies large footprint for high-pin count die. Th...

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Veröffentlicht in:	IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2014-02, Vol.4 (2), p.352-359
Hauptverfasser:	Chang, Ka Fai, Li, Rui, Jin, Cheng, Lim, Teck Guan, Ho, Soon Wee, Hwang, How Yuan, Zheng, Boyu
Format:	Artikel
Sprache:	eng
Schlagworte:	3-D integration Antenna measurements automotive radar embedded wafer level packaging Lenses Loss measurement Prototypes Radar Radar antennas through mold via
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