Thermal modeling of integrated power electronic modules by a lumped-parameter circuit approach

With the continuous volume reduction of the devices and power modules having the same power conditioning capability, it becomes more and more important to manage the increase of the junction temperature due to the increase of the specific power dissipations. Therefore, in order to ensure the working...

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Bibliographische Detailangaben

Hauptverfasser:	Raciti, Angelo, Cristaldi, Davide
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Aluminum oxide Ceramics Copper cross-heating Decision support systems Finite element analysis Heat transfer Impedance IPEM thermal impedance matrix thermal model
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