Successful failure analysis using fault diagnosis tool and product characterization board in BiCMOS technology low yield investigation

Successful failure analysis using fault diagnosis tool and product characterization board in BiCMOS technology low yield investigation

The conventional failure analysis methods are not efficient in analyzing Systems on Chip (SoC) ICs. Electrical failure analysis using a Fault Diagnosis Tool (FDT) and Product Characterization Board can help to precisely localize the defect. Failure analysis of two BiCMOS products using these methods...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: Liu, Renee, Chin, Aaron, Seah Pei Hong, Lee Wenfeng
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Decision support systems
Failure analysis
Integrated circuits
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Beschreibung
Zusammenfassung:The conventional failure analysis methods are not efficient in analyzing Systems on Chip (SoC) ICs. Electrical failure analysis using a Fault Diagnosis Tool (FDT) and Product Characterization Board can help to precisely localize the defect. Failure analysis of two BiCMOS products using these methods will be demonstrated in this paper. Detail analysis of using these two methods are presented and discussed.
ISSN:1946-1542
1946-1550
DOI:10.1109/IPFA.2013.6599238