Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules
This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturization is achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and...
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| creator | Sato, Yoichiro Sitaraman, Srikrishna Sukumaran, Vijay Chou, Bruce Junki Min Ono, Motoshi Karoui, Choukri Dosseul, Franck Nopper, Christian Swaminathan, Madhavan Sundaram, Venky Tummala, Rao |
| description | This paper demonstrates ultra-miniaturized RF passive components integrated on thin glass substrate with small Through Package Vias (TPVs) to realize 3D Integrated Passive and Actives Component (IPAC) concept. Miniaturization is achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and c) small TPVs. Inductors, capacitors and low pass filters functioning in the frequency range of 0.8 GHz to 5.4 GHz were modeled and fabricated between thin dielectric layers on 100 μm thin glass, and then assembled on PCB through BGA interconnections. The simulated results corroborated well with measured results, providing guidelines for RF module fabrication. |
| doi_str_mv | 10.1109/ECTC.2013.6575795 |
| format | Conference Proceeding |
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Miniaturization is achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and c) small TPVs. Inductors, capacitors and low pass filters functioning in the frequency range of 0.8 GHz to 5.4 GHz were modeled and fabricated between thin dielectric layers on 100 μm thin glass, and then assembled on PCB through BGA interconnections. 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Miniaturization is achieved through; a) ultra-thin glass, b) low-loss thin dielectrics and c) small TPVs. Inductors, capacitors and low pass filters functioning in the frequency range of 0.8 GHz to 5.4 GHz were modeled and fabricated between thin dielectric layers on 100 μm thin glass, and then assembled on PCB through BGA interconnections. The simulated results corroborated well with measured results, providing guidelines for RF module fabrication.</abstract><pub>IEEE</pub><doi>10.1109/ECTC.2013.6575795</doi><tpages>6</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 0569-5503 |
| ispartof | 2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.1656-1661 |
| issn | 0569-5503 2377-5726 |
| language | eng |
| recordid | cdi_ieee_primary_6575795 |
| source | IEEE Electronic Library (IEL) Conference Proceedings |
| subjects | glass interposer RF passive components |
| title | Ultra-miniaturized and surface-mountable glass-based 3D IPAC packages for RF modules |
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