Reliability of flip-chip technologies for SiC-MEMS operating at 500 °C

The flip-chip technology has many advantages over standard wire bonding processes especially as interconnection technique for MEMS operating in harsh environments. In this paper, silver based micro contact bumps are investigated with test assemblies on their reliability for an operating temperature...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Zeiser, Roderich, Lehmann, Lukas, Fiedler, Volker, Wilde, Juergen
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Flip-chip devices Reliability Silver Substrates Temperature measurement
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