Room-temperature high-density interconnection using ultrasonic bonding of cone bump for heterogeneous integration

We show that room temperature bonding of a 332 × 268 bump array can be realized by using ultrasonic bonding of cone-shaped bump. 25 μm-pitch area array of cone-shaped Au bump was fabricated on a Si wafer by using a photolithography and electroplating. A conventional planar electrode made of electrop...

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Bibliographische Detailangaben

Hauptverfasser:	Shuto, Takanori, Iwanabe, Keiichiro, Li Jing Qiu, Asano, Tanemasa
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Acoustics Arrays Bonding Electrodes Gold Indium phosphide Silicon
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