Package-on-package with very fine pitch interconnects for high bandwidth

Computing platforms are trending towards multi-core and low power processors coupled with high bandwidth memory in close proximity for both client and cloud applications. The most critical feature to keep increasing the performance is the processor-memory interconnect. This is best achieved by placi...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Mohammed, Ilyas, Co, Reynaldo, Katkar, Rajesh
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Assembly Bandwidth Palladium Plasmas Program processors Wires
Online-Zugang:	Volltext bestellen
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