Effect of metal finishing fabricated by electro and Electroless plating process on reliability performance of 30μm-pitch solder micro bump interconnection

Recently, three dimensional integration circuits technology has received much attention because of the demands of gradually increasing functionality and performance in microelectronic packaging for different types of electronic devices. For 3D chip stacking, high density interconnections are require...

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Bibliographische Detailangaben

Hauptverfasser:	Jing-Ye Juang, Shin-Yi Huang, Chau-Jie Zhan, Yu-Min Lin, Yu-Wei Huang, Chia-Wen Fan, Su-Ching Chung, Su-Mei Chen, Jon-Shiou Peng, Yu-Lan Lu, Pai-Cheng Chang, Mei-Lun Wu, Lau, John H.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Gold Joints Microstructure Nickel Reliability Silicon Tin
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