TSV-based quartz crystal resonator using 3D integration and Si packaging technologies

In this paper, one novel packaging approach for crystal resonator with the quartz crystal is demonstrated, developed and characterized. The proposed crystal resonator of the novel package adopts several 3-D core technologies, such as Cu TSVs, thin-film Cu/Sn eutectic bonding, and wafer thinning. A 1...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Jian-Yu Shih, Yen-Chi Chen, Cheng-Hao Chiang, Chih-Hung Chiu, Yu-Chen Hu, Chung-Lun Lo, Chi-Chung Chang, Kuan-Neng Chen
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Cavity resonators Crystals Silicon Through-silicon vias Tin
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