Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications
Thermosonic flip-chip bonding (TS-FCB) is known as a technique suitable for low-temperature bonding and has been used in many integration applications. In this paper, a modified TS-FCB based on microbumps and concave pads, is presented. Electroplated Cu microbumps, and etched invert-pyramid-shape bo...
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| creator | Tung Thanh Bui Suzuki, Motohiro Kato, Fumiki Watanabe, Naoya Nemoto, Shunsuke Kikuchi, Katsuya Aoyagi, Masahiro |
| description | Thermosonic flip-chip bonding (TS-FCB) is known as a technique suitable for low-temperature bonding and has been used in many integration applications. In this paper, a modified TS-FCB based on microbumps and concave pads, is presented. Electroplated Cu microbumps, and etched invert-pyramid-shape bonding pads are used to enhance the bonding accuracy of the conventional TS-FCB technique. Experimental validation of the bonding approach is conducted. Reliable bonds, with significant increase in the post-bond accuracy, i.e. within 1 μm range in in-plane offsets, are obtained at 120°C using the proposed bonding approach. These achievements illustrate the ability to use this approach for high-precision low-temperature converging applications. |
| doi_str_mv | 10.1109/ECTC.2013.6575606 |
| format | Conference Proceeding |
| fullrecord | <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6575606</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6575606</ieee_id><sourcerecordid>6575606</sourcerecordid><originalsourceid>FETCH-LOGICAL-i241t-5d24fe2a9a965df78dc3159a02ba9db551275523fe0dceb70041ce07389145183</originalsourceid><addsrcrecordid>eNo1UElOwzAUNZNEW3oAxMYXcPEQx_ESRWWQitiUdeXYP61RElt2CuIg3JdIlNWT3iS9h9AtoyvGqL5f19t6xSkTq1IqWdLyDM1ZobSmXHB-jmZcKEWk4uUFWmpV_WuCXqIZlaUmUlJxjeY5f1BaUMqqGfp5Dc63HhweD5D6kMPgLW47H4k9-IibMDg_7HFj8uQJA4YO7JhC7Mw4EfUR996m0Bz7mLEZHLZhsOYTcDQu4zYkfPD7A4kJrM9-ynfhi4zQR0hmPCbAJmfom-4bmxg7b804mfINumpNl2F5wgV6f1xv62eyeXt6qR82xPOCjUQ6XrTAjTa6lK5VlbOCSW0ob4x2jZSMKym5aIE6C42aVjMLVIlKs0KySizQ3V-vB4BdTL436Xt3ulf8Ap-jbds</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Tung Thanh Bui ; Suzuki, Motohiro ; Kato, Fumiki ; Watanabe, Naoya ; Nemoto, Shunsuke ; Kikuchi, Katsuya ; Aoyagi, Masahiro</creator><creatorcontrib>Tung Thanh Bui ; Suzuki, Motohiro ; Kato, Fumiki ; Watanabe, Naoya ; Nemoto, Shunsuke ; Kikuchi, Katsuya ; Aoyagi, Masahiro</creatorcontrib><description>Thermosonic flip-chip bonding (TS-FCB) is known as a technique suitable for low-temperature bonding and has been used in many integration applications. In this paper, a modified TS-FCB based on microbumps and concave pads, is presented. Electroplated Cu microbumps, and etched invert-pyramid-shape bonding pads are used to enhance the bonding accuracy of the conventional TS-FCB technique. Experimental validation of the bonding approach is conducted. Reliable bonds, with significant increase in the post-bond accuracy, i.e. within 1 μm range in in-plane offsets, are obtained at 120°C using the proposed bonding approach. These achievements illustrate the ability to use this approach for high-precision low-temperature converging applications.</description><identifier>ISSN: 0569-5503</identifier><identifier>ISBN: 9781479902330</identifier><identifier>ISBN: 1479902330</identifier><identifier>EISSN: 2377-5726</identifier><identifier>EISBN: 1479902322</identifier><identifier>EISBN: 9781479902323</identifier><identifier>DOI: 10.1109/ECTC.2013.6575606</identifier><language>eng</language><publisher>IEEE</publisher><subject>Accuracy ; Bonding ; Force ; Friction ; Substrates ; Surface treatment</subject><ispartof>2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.425-430</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6575606$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,780,784,789,790,2056,27924,54919</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6575606$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Tung Thanh Bui</creatorcontrib><creatorcontrib>Suzuki, Motohiro</creatorcontrib><creatorcontrib>Kato, Fumiki</creatorcontrib><creatorcontrib>Watanabe, Naoya</creatorcontrib><creatorcontrib>Nemoto, Shunsuke</creatorcontrib><creatorcontrib>Kikuchi, Katsuya</creatorcontrib><creatorcontrib>Aoyagi, Masahiro</creatorcontrib><title>Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications</title><title>2013 IEEE 63rd Electronic Components and Technology Conference</title><addtitle>ECTC</addtitle><description>Thermosonic flip-chip bonding (TS-FCB) is known as a technique suitable for low-temperature bonding and has been used in many integration applications. In this paper, a modified TS-FCB based on microbumps and concave pads, is presented. Electroplated Cu microbumps, and etched invert-pyramid-shape bonding pads are used to enhance the bonding accuracy of the conventional TS-FCB technique. Experimental validation of the bonding approach is conducted. Reliable bonds, with significant increase in the post-bond accuracy, i.e. within 1 μm range in in-plane offsets, are obtained at 120°C using the proposed bonding approach. These achievements illustrate the ability to use this approach for high-precision low-temperature converging applications.</description><subject>Accuracy</subject><subject>Bonding</subject><subject>Force</subject><subject>Friction</subject><subject>Substrates</subject><subject>Surface treatment</subject><issn>0569-5503</issn><issn>2377-5726</issn><isbn>9781479902330</isbn><isbn>1479902330</isbn><isbn>1479902322</isbn><isbn>9781479902323</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2013</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1UElOwzAUNZNEW3oAxMYXcPEQx_ESRWWQitiUdeXYP61RElt2CuIg3JdIlNWT3iS9h9AtoyvGqL5f19t6xSkTq1IqWdLyDM1ZobSmXHB-jmZcKEWk4uUFWmpV_WuCXqIZlaUmUlJxjeY5f1BaUMqqGfp5Dc63HhweD5D6kMPgLW47H4k9-IibMDg_7HFj8uQJA4YO7JhC7Mw4EfUR996m0Bz7mLEZHLZhsOYTcDQu4zYkfPD7A4kJrM9-ynfhi4zQR0hmPCbAJmfom-4bmxg7b804mfINumpNl2F5wgV6f1xv62eyeXt6qR82xPOCjUQ6XrTAjTa6lK5VlbOCSW0ob4x2jZSMKym5aIE6C42aVjMLVIlKs0KySizQ3V-vB4BdTL436Xt3ulf8Ap-jbds</recordid><startdate>201305</startdate><enddate>201305</enddate><creator>Tung Thanh Bui</creator><creator>Suzuki, Motohiro</creator><creator>Kato, Fumiki</creator><creator>Watanabe, Naoya</creator><creator>Nemoto, Shunsuke</creator><creator>Kikuchi, Katsuya</creator><creator>Aoyagi, Masahiro</creator><general>IEEE</general><scope>6IE</scope><scope>6IH</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIO</scope></search><sort><creationdate>201305</creationdate><title>Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications</title><author>Tung Thanh Bui ; Suzuki, Motohiro ; Kato, Fumiki ; Watanabe, Naoya ; Nemoto, Shunsuke ; Kikuchi, Katsuya ; Aoyagi, Masahiro</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i241t-5d24fe2a9a965df78dc3159a02ba9db551275523fe0dceb70041ce07389145183</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Accuracy</topic><topic>Bonding</topic><topic>Force</topic><topic>Friction</topic><topic>Substrates</topic><topic>Surface treatment</topic><toplevel>online_resources</toplevel><creatorcontrib>Tung Thanh Bui</creatorcontrib><creatorcontrib>Suzuki, Motohiro</creatorcontrib><creatorcontrib>Kato, Fumiki</creatorcontrib><creatorcontrib>Watanabe, Naoya</creatorcontrib><creatorcontrib>Nemoto, Shunsuke</creatorcontrib><creatorcontrib>Kikuchi, Katsuya</creatorcontrib><creatorcontrib>Aoyagi, Masahiro</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan (POP) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP) 1998-present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Tung Thanh Bui</au><au>Suzuki, Motohiro</au><au>Kato, Fumiki</au><au>Watanabe, Naoya</au><au>Nemoto, Shunsuke</au><au>Kikuchi, Katsuya</au><au>Aoyagi, Masahiro</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications</atitle><btitle>2013 IEEE 63rd Electronic Components and Technology Conference</btitle><stitle>ECTC</stitle><date>2013-05</date><risdate>2013</risdate><spage>425</spage><epage>430</epage><pages>425-430</pages><issn>0569-5503</issn><eissn>2377-5726</eissn><isbn>9781479902330</isbn><isbn>1479902330</isbn><eisbn>1479902322</eisbn><eisbn>9781479902323</eisbn><abstract>Thermosonic flip-chip bonding (TS-FCB) is known as a technique suitable for low-temperature bonding and has been used in many integration applications. In this paper, a modified TS-FCB based on microbumps and concave pads, is presented. Electroplated Cu microbumps, and etched invert-pyramid-shape bonding pads are used to enhance the bonding accuracy of the conventional TS-FCB technique. Experimental validation of the bonding approach is conducted. Reliable bonds, with significant increase in the post-bond accuracy, i.e. within 1 μm range in in-plane offsets, are obtained at 120°C using the proposed bonding approach. These achievements illustrate the ability to use this approach for high-precision low-temperature converging applications.</abstract><pub>IEEE</pub><doi>10.1109/ECTC.2013.6575606</doi><tpages>6</tpages></addata></record> |
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| ispartof | 2013 IEEE 63rd Electronic Components and Technology Conference, 2013, p.425-430 |
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| subjects | Accuracy Bonding Force Friction Substrates Surface treatment |
| title | Modified thermosonic flip-chip bonding based on electroplated Cu microbumps and concave pads for high-precision low-temperature assembly applications |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-12T16%3A15%3A51IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Modified%20thermosonic%20flip-chip%20bonding%20based%20on%20electroplated%20Cu%20microbumps%20and%20concave%20pads%20for%20high-precision%20low-temperature%20assembly%20applications&rft.btitle=2013%20IEEE%2063rd%20Electronic%20Components%20and%20Technology%20Conference&rft.au=Tung%20Thanh%20Bui&rft.date=2013-05&rft.spage=425&rft.epage=430&rft.pages=425-430&rft.issn=0569-5503&rft.eissn=2377-5726&rft.isbn=9781479902330&rft.isbn_list=1479902330&rft_id=info:doi/10.1109/ECTC.2013.6575606&rft_dat=%3Cieee_6IE%3E6575606%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1479902322&rft.eisbn_list=9781479902323&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6575606&rfr_iscdi=true |