Exploring early design tradeoffs in 3DIC

This The key to gaining substantial benefit from the use of 3DIC technology is to create 3D specific designs that do more than recast a 2D optimal design into the third dimension. This paper explores some of the approaches to creating 3D specific designs and the CAD tools that can help in that explo...

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Bibliographische Detailangaben

Hauptverfasser:	Franzon, Paul D., Priyadarshi, Shivam, Lipa, Steve, Davis, W. Rhett, Thorolfsson, Thor
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bandwidth Face Integrated circuit interconnections Random access memory Silicon Through-silicon vias Wires
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