Mechanical stability analysis of organic thin film transistors considering interfacial delamination

The mechanical characteristics of organic thin film transistor (OTFT) currently capture increasing researchers' attentions for its advanced applications. Experiments have shown that the failures of the device during bending test highlight in the interfacial delamination of the top-electrode in...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Zhoulong Xu, Bo Tao, Zunxu Liu
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Delamination energy release rate Finite element analysis interfacial crack Organic thin film transistors OTFT Stress Substrates VCCT
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