Bit Cost Scalable (BiCS) technology for future ultra high density memories

We proposed Bit Cost Scalable (BiCS) technology in 2007 as a three-dimensional memory for the future ultra high density storage devices, which extremely reduce the bit costs by vertically stacking memory arrays with punch and plug process. We've applied it to just NAND flash, which is BiCS Flas...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Nitayama, A., Aochi, H.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Electrodes Flash memories Logic gates SONOS devices Three-dimensional displays Very large scale integration
Online-Zugang:	Volltext bestellen
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