Bit Cost Scalable (BiCS) technology for future ultra high density memories

Bit Cost Scalable (BiCS) technology for future ultra high density memories

We proposed Bit Cost Scalable (BiCS) technology in 2007 as a three-dimensional memory for the future ultra high density storage devices, which extremely reduce the bit costs by vertically stacking memory arrays with punch and plug process. We've applied it to just NAND flash, which is BiCS Flas...

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Hauptverfasser: Nitayama, A., Aochi, H.
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Sprache:eng
Schlagworte:
Electrodes
Flash memories
Logic gates
SONOS devices
Three-dimensional displays
Very large scale integration
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Aochi, H.
description We proposed Bit Cost Scalable (BiCS) technology in 2007 as a three-dimensional memory for the future ultra high density storage devices, which extremely reduce the bit costs by vertically stacking memory arrays with punch and plug process. We've applied it to just NAND flash, which is BiCS Flash memory, and established the mass production technology. Moreover, we can apply the BiCS technology to various memories. The critical issues and the comparison among various 3D NAND Flash-type memories are to be discussed, as well.
doi_str_mv 10.1109/VLSI-TSA.2013.6545626
format Conference Proceeding
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subjects Electrodes
Flash memories
Logic gates
SONOS devices
Three-dimensional displays
Very large scale integration
title Bit Cost Scalable (BiCS) technology for future ultra high density memories
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