Properties of silicon thin films grown by the temperature difference method (TDM)

In this paper we describe the temperature difference method (TDM) as a promising technology for the continuous growth of thin film silicon from the solution on large area polycrystalline substrates (10/spl times/10 cm/sup 2/). The thermodynamic driving force of the layer growth by TDM is generated b...

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Bibliographische Detailangaben
Hauptverfasser: Thomas, B., Muller, G., Wilde, P.-M., Wawra, H.
Format: Tagungsbericht
Sprache:eng
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