New electrical testing structures and analysis method for MOL and BEOL process diagnostics and TDDB reliability assessment

Both MOL PC-CA spacer dielectric and BEOL low-k dielectric breakdown data are commonly convoluted with multiple variables present in the data due to the involvement of many process steps such as lithography, etch, CMP, cleaning, and thin film deposition. With the continuing aggressive scaling of dev...

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Bibliographische Detailangaben

Hauptverfasser:	Fen Chen, Mittl, S., Shinosky, M., Dufresne, R., Aitken, J., Yanfeng Wang, Kolvenback, K., Henson, W. K., Mocuta, D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Dielectric breakdown Equations Logic gates low-k reliability low-k TDDB MOL reliability Optical variables measurement PC-CA reliabiltiy PC-CA TDDB Pollution measurement Reliability
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