Parallel C4 Packaging of MEMS Using Self-Alignment: Simulation and Experiments
Packaging is one of the major cost drivers for microelectromechanical systems (MEMS). Currently wire bonding is the dominant method for electrically connecting MEMS chips to the substrate. Using self-alignment, a method for packaging multiple MEMS at the same time has been developed. The presented p...
Gespeichert in:
| Veröffentlicht in: | IEEE transactions on components, packaging, and manufacturing technology (2011) packaging, and manufacturing technology (2011), 2013-08, Vol.3 (8), p.1420-1429 |
|---|---|
| Hauptverfasser: | , , , |
| Format: | Artikel |
| Sprache: | eng |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | 1429 |
|---|---|
| container_issue | 8 |
| container_start_page | 1420 |
| container_title | IEEE transactions on components, packaging, and manufacturing technology (2011) |
| container_volume | 3 |
| creator | Taprogge, Jens L. M. Beyeler, Felix Steinecker, Alexander Nelson, Bradley J. |
| description | Packaging is one of the major cost drivers for microelectromechanical systems (MEMS). Currently wire bonding is the dominant method for electrically connecting MEMS chips to the substrate. Using self-alignment, a method for packaging multiple MEMS at the same time has been developed. The presented process achieves high throughput and precise alignment at low cost. The controlled collapse chip connection (C4) process has been adapted to the specific requirements of MEMS. The combination of coarse robotics and liquid solder self-alignment guarantees precise positioning and alignment of the individual MEMS chips to the respective substrates. The new method has been implemented in a case study. In the study, force sensors were packaged. Precise angular alignment of the sensors is critical for making accurate measurements. Results of the case study are presented. The alignment motion is analyzed, compared with results in the literature, and simulated. These simulations, in combination with our experiments, indicate that the motion is dominated by solder-specific effects such as oxide removal, wetting, and flux solvent evaporation. |
| doi_str_mv | 10.1109/TCPMT.2013.2254489 |
| format | Article |
| fullrecord | <record><control><sourceid>crossref_RIE</sourceid><recordid>TN_cdi_ieee_primary_6530637</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6530637</ieee_id><sourcerecordid>10_1109_TCPMT_2013_2254489</sourcerecordid><originalsourceid>FETCH-LOGICAL-c267t-3104b706ae1eca07a57b7caafda3fff9fc939fbcdc042de427aa86608ff1c62b3</originalsourceid><addsrcrecordid>eNo9kN1qwzAMRs3YYKXrC2w3foF0sh3bye5K6H6g2Qptr4Pi2MWbm5S4g-3t16ylupE-xBHiEHLPYMoY5I_rYlmupxyYmHIu0zTLr8iIM6kSkWfy-jJLuCWTGD_hWDIDDWJE3pfYYwg20CKlSzRfuPXtlnaOlvNyRTdxSCsbXDILftvubHt4oiu_-w548F1LsW3o_Gdvez-s4h25cRiinZz7mGye5-viNVl8vLwVs0ViuNKHRDBIaw0KLbMGQaPUtTaIrkHhnMudyUXuatMYSHljU64RM6Ugc44ZxWsxJvx01_RdjL111f74Afa_FYNqkFL9S6kGKdVZyhF6OEHeWnsBlBSghBZ_PoFecQ</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype></control><display><type>article</type><title>Parallel C4 Packaging of MEMS Using Self-Alignment: Simulation and Experiments</title><source>IEEE Electronic Library (IEL)</source><creator>Taprogge, Jens L. M. ; Beyeler, Felix ; Steinecker, Alexander ; Nelson, Bradley J.</creator><creatorcontrib>Taprogge, Jens L. M. ; Beyeler, Felix ; Steinecker, Alexander ; Nelson, Bradley J.</creatorcontrib><description>Packaging is one of the major cost drivers for microelectromechanical systems (MEMS). Currently wire bonding is the dominant method for electrically connecting MEMS chips to the substrate. Using self-alignment, a method for packaging multiple MEMS at the same time has been developed. The presented process achieves high throughput and precise alignment at low cost. The controlled collapse chip connection (C4) process has been adapted to the specific requirements of MEMS. The combination of coarse robotics and liquid solder self-alignment guarantees precise positioning and alignment of the individual MEMS chips to the respective substrates. The new method has been implemented in a case study. In the study, force sensors were packaged. Precise angular alignment of the sensors is critical for making accurate measurements. Results of the case study are presented. The alignment motion is analyzed, compared with results in the literature, and simulated. These simulations, in combination with our experiments, indicate that the motion is dominated by solder-specific effects such as oxide removal, wetting, and flux solvent evaporation.</description><identifier>ISSN: 2156-3950</identifier><identifier>EISSN: 2156-3985</identifier><identifier>DOI: 10.1109/TCPMT.2013.2254489</identifier><identifier>CODEN: ITCPC8</identifier><language>eng</language><publisher>IEEE</publisher><subject>Alignment ; bismuth ; Bonding ; chip-scale packaging (CSP) ; controlled collapse chip connection (C4) ; deep reactive ion etching (DRIE) ; direct chip attach (DCA) ; dynamics ; FemtoTools ; flip chip ; flux ; force sensor ; Heating ; microelectromechanical systems (MEMS) ; Micromechanical devices ; microoptoelectromechanical systems (MOEMS) ; motion ; Packaging ; Robots ; self-alignment ; silicon-on-insulator (SOI) ; simulation ; solder paste ; Substrates ; Surface tension ; wafer-level packaging (WLP) ; wetting</subject><ispartof>IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-08, Vol.3 (8), p.1420-1429</ispartof><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed><citedby>FETCH-LOGICAL-c267t-3104b706ae1eca07a57b7caafda3fff9fc939fbcdc042de427aa86608ff1c62b3</citedby><cites>FETCH-LOGICAL-c267t-3104b706ae1eca07a57b7caafda3fff9fc939fbcdc042de427aa86608ff1c62b3</cites></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6530637$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>314,776,780,792,27901,27902,54733</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6530637$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Taprogge, Jens L. M.</creatorcontrib><creatorcontrib>Beyeler, Felix</creatorcontrib><creatorcontrib>Steinecker, Alexander</creatorcontrib><creatorcontrib>Nelson, Bradley J.</creatorcontrib><title>Parallel C4 Packaging of MEMS Using Self-Alignment: Simulation and Experiments</title><title>IEEE transactions on components, packaging, and manufacturing technology (2011)</title><addtitle>TCPMT</addtitle><description>Packaging is one of the major cost drivers for microelectromechanical systems (MEMS). Currently wire bonding is the dominant method for electrically connecting MEMS chips to the substrate. Using self-alignment, a method for packaging multiple MEMS at the same time has been developed. The presented process achieves high throughput and precise alignment at low cost. The controlled collapse chip connection (C4) process has been adapted to the specific requirements of MEMS. The combination of coarse robotics and liquid solder self-alignment guarantees precise positioning and alignment of the individual MEMS chips to the respective substrates. The new method has been implemented in a case study. In the study, force sensors were packaged. Precise angular alignment of the sensors is critical for making accurate measurements. Results of the case study are presented. The alignment motion is analyzed, compared with results in the literature, and simulated. These simulations, in combination with our experiments, indicate that the motion is dominated by solder-specific effects such as oxide removal, wetting, and flux solvent evaporation.</description><subject>Alignment</subject><subject>bismuth</subject><subject>Bonding</subject><subject>chip-scale packaging (CSP)</subject><subject>controlled collapse chip connection (C4)</subject><subject>deep reactive ion etching (DRIE)</subject><subject>direct chip attach (DCA)</subject><subject>dynamics</subject><subject>FemtoTools</subject><subject>flip chip</subject><subject>flux</subject><subject>force sensor</subject><subject>Heating</subject><subject>microelectromechanical systems (MEMS)</subject><subject>Micromechanical devices</subject><subject>microoptoelectromechanical systems (MOEMS)</subject><subject>motion</subject><subject>Packaging</subject><subject>Robots</subject><subject>self-alignment</subject><subject>silicon-on-insulator (SOI)</subject><subject>simulation</subject><subject>solder paste</subject><subject>Substrates</subject><subject>Surface tension</subject><subject>wafer-level packaging (WLP)</subject><subject>wetting</subject><issn>2156-3950</issn><issn>2156-3985</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2013</creationdate><recordtype>article</recordtype><sourceid>RIE</sourceid><recordid>eNo9kN1qwzAMRs3YYKXrC2w3foF0sh3bye5K6H6g2Qptr4Pi2MWbm5S4g-3t16ylupE-xBHiEHLPYMoY5I_rYlmupxyYmHIu0zTLr8iIM6kSkWfy-jJLuCWTGD_hWDIDDWJE3pfYYwg20CKlSzRfuPXtlnaOlvNyRTdxSCsbXDILftvubHt4oiu_-w548F1LsW3o_Gdvez-s4h25cRiinZz7mGye5-viNVl8vLwVs0ViuNKHRDBIaw0KLbMGQaPUtTaIrkHhnMudyUXuatMYSHljU64RM6Ugc44ZxWsxJvx01_RdjL111f74Afa_FYNqkFL9S6kGKdVZyhF6OEHeWnsBlBSghBZ_PoFecQ</recordid><startdate>20130801</startdate><enddate>20130801</enddate><creator>Taprogge, Jens L. M.</creator><creator>Beyeler, Felix</creator><creator>Steinecker, Alexander</creator><creator>Nelson, Bradley J.</creator><general>IEEE</general><scope>97E</scope><scope>RIA</scope><scope>RIE</scope><scope>AAYXX</scope><scope>CITATION</scope></search><sort><creationdate>20130801</creationdate><title>Parallel C4 Packaging of MEMS Using Self-Alignment: Simulation and Experiments</title><author>Taprogge, Jens L. M. ; Beyeler, Felix ; Steinecker, Alexander ; Nelson, Bradley J.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c267t-3104b706ae1eca07a57b7caafda3fff9fc939fbcdc042de427aa86608ff1c62b3</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Alignment</topic><topic>bismuth</topic><topic>Bonding</topic><topic>chip-scale packaging (CSP)</topic><topic>controlled collapse chip connection (C4)</topic><topic>deep reactive ion etching (DRIE)</topic><topic>direct chip attach (DCA)</topic><topic>dynamics</topic><topic>FemtoTools</topic><topic>flip chip</topic><topic>flux</topic><topic>force sensor</topic><topic>Heating</topic><topic>microelectromechanical systems (MEMS)</topic><topic>Micromechanical devices</topic><topic>microoptoelectromechanical systems (MOEMS)</topic><topic>motion</topic><topic>Packaging</topic><topic>Robots</topic><topic>self-alignment</topic><topic>silicon-on-insulator (SOI)</topic><topic>simulation</topic><topic>solder paste</topic><topic>Substrates</topic><topic>Surface tension</topic><topic>wafer-level packaging (WLP)</topic><topic>wetting</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Taprogge, Jens L. M.</creatorcontrib><creatorcontrib>Beyeler, Felix</creatorcontrib><creatorcontrib>Steinecker, Alexander</creatorcontrib><creatorcontrib>Nelson, Bradley J.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>CrossRef</collection><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Taprogge, Jens L. M.</au><au>Beyeler, Felix</au><au>Steinecker, Alexander</au><au>Nelson, Bradley J.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Parallel C4 Packaging of MEMS Using Self-Alignment: Simulation and Experiments</atitle><jtitle>IEEE transactions on components, packaging, and manufacturing technology (2011)</jtitle><stitle>TCPMT</stitle><date>2013-08-01</date><risdate>2013</risdate><volume>3</volume><issue>8</issue><spage>1420</spage><epage>1429</epage><pages>1420-1429</pages><issn>2156-3950</issn><eissn>2156-3985</eissn><coden>ITCPC8</coden><abstract>Packaging is one of the major cost drivers for microelectromechanical systems (MEMS). Currently wire bonding is the dominant method for electrically connecting MEMS chips to the substrate. Using self-alignment, a method for packaging multiple MEMS at the same time has been developed. The presented process achieves high throughput and precise alignment at low cost. The controlled collapse chip connection (C4) process has been adapted to the specific requirements of MEMS. The combination of coarse robotics and liquid solder self-alignment guarantees precise positioning and alignment of the individual MEMS chips to the respective substrates. The new method has been implemented in a case study. In the study, force sensors were packaged. Precise angular alignment of the sensors is critical for making accurate measurements. Results of the case study are presented. The alignment motion is analyzed, compared with results in the literature, and simulated. These simulations, in combination with our experiments, indicate that the motion is dominated by solder-specific effects such as oxide removal, wetting, and flux solvent evaporation.</abstract><pub>IEEE</pub><doi>10.1109/TCPMT.2013.2254489</doi><tpages>10</tpages></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | ISSN: 2156-3950 |
| ispartof | IEEE transactions on components, packaging, and manufacturing technology (2011), 2013-08, Vol.3 (8), p.1420-1429 |
| issn | 2156-3950 2156-3985 |
| language | eng |
| recordid | cdi_ieee_primary_6530637 |
| source | IEEE Electronic Library (IEL) |
| subjects | Alignment bismuth Bonding chip-scale packaging (CSP) controlled collapse chip connection (C4) deep reactive ion etching (DRIE) direct chip attach (DCA) dynamics FemtoTools flip chip flux force sensor Heating microelectromechanical systems (MEMS) Micromechanical devices microoptoelectromechanical systems (MOEMS) motion Packaging Robots self-alignment silicon-on-insulator (SOI) simulation solder paste Substrates Surface tension wafer-level packaging (WLP) wetting |
| title | Parallel C4 Packaging of MEMS Using Self-Alignment: Simulation and Experiments |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T03%3A13%3A57IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-crossref_RIE&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=Parallel%20C4%20Packaging%20of%20MEMS%20Using%20Self-Alignment:%20Simulation%20and%20Experiments&rft.jtitle=IEEE%20transactions%20on%20components,%20packaging,%20and%20manufacturing%20technology%20(2011)&rft.au=Taprogge,%20Jens%20L.%20M.&rft.date=2013-08-01&rft.volume=3&rft.issue=8&rft.spage=1420&rft.epage=1429&rft.pages=1420-1429&rft.issn=2156-3950&rft.eissn=2156-3985&rft.coden=ITCPC8&rft_id=info:doi/10.1109/TCPMT.2013.2254489&rft_dat=%3Ccrossref_RIE%3E10_1109_TCPMT_2013_2254489%3C/crossref_RIE%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6530637&rfr_iscdi=true |