Electro-thermal modeling to quantify the electrothermal impact of the solder joint delamination on power device assemblies

Electro-thermal modeling to quantify the electrothermal impact of the solder joint delamination on power device assemblies

This paper presents the use of 3D transient electrothermal modeling methodology to investigate the effects of delamination on power MOSFET with SnPb soldering when a charge short-circuit occurs. The results given by electro-thermal simulations allow the study of phenomena difficult to capture experi...

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Hauptverfasser: Azoui, T., Marcault, E., Tounsi, P., Massol, J. L., Dorkel, J. M., Dupuy, P.
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creator Azoui, T.
Marcault, E.
Tounsi, P.
Massol, J. L.
Dorkel, J. M.
Dupuy, P.
description This paper presents the use of 3D transient electrothermal modeling methodology to investigate the effects of delamination on power MOSFET with SnPb soldering when a charge short-circuit occurs. The results given by electro-thermal simulations allow the study of phenomena difficult to capture experimentally, like focalization of the temperature and current densities due to the structure topology and resistivity variation. The use of sintered silver instead of SnPb could reduce the delamination extension, but it gives also improvements in terms of thermal and electrical resistivities. These latest improvements are quantified in this paper.
doi_str_mv 10.1109/EuroSimE.2013.6529916
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fullrecord <record><control><sourceid>ieee_6IE</sourceid><recordid>TN_cdi_ieee_primary_6529916</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6529916</ieee_id><sourcerecordid>6529916</sourcerecordid><originalsourceid>FETCH-LOGICAL-i175t-eda9b22cf1da0cf0cfacf9ee2886d38ecc0816a5cf462e5059b64879ce8741a03</originalsourceid><addsrcrecordid>eNo1kN1KAzEQhSMiqLVPIEJeYNdkf7LJpZTVCgUv1OsyzU40ZbNZN6lSn95gW-bAMHxnzsUh5I6znHOm7tvd5F-ta_OC8TIXdaEUF2fkmleiKQUvlTonc9XI0y3rSzIPYcsYS_9Nmivy2_ao4-Sz-ImTg54632Fvhw8aPf3awRCt2dMEKR6MJ591I-hIvfmHwfcdTnTr7RBpCgBnB4jWDzRp9D-JdfhtNVIIAd2mtxhuyIWBPuD8uGfk_bF9Wyyz1cvT8-JhlVne1DHDDtSmKLThHTBtkkAbhVhIKbpSotZMcgG1NpUosGa12ohKNkqjbCoOrJyR20OuRcT1OFkH0359rKv8A7Y3Y80</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Electro-thermal modeling to quantify the electrothermal impact of the solder joint delamination on power device assemblies</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Azoui, T. ; Marcault, E. ; Tounsi, P. ; Massol, J. L. ; Dorkel, J. M. ; Dupuy, P.</creator><creatorcontrib>Azoui, T. ; Marcault, E. ; Tounsi, P. ; Massol, J. L. ; Dorkel, J. M. ; Dupuy, P.</creatorcontrib><description>This paper presents the use of 3D transient electrothermal modeling methodology to investigate the effects of delamination on power MOSFET with SnPb soldering when a charge short-circuit occurs. The results given by electro-thermal simulations allow the study of phenomena difficult to capture experimentally, like focalization of the temperature and current densities due to the structure topology and resistivity variation. The use of sintered silver instead of SnPb could reduce the delamination extension, but it gives also improvements in terms of thermal and electrical resistivities. These latest improvements are quantified in this paper.</description><identifier>ISBN: 9781467361385</identifier><identifier>ISBN: 1467361380</identifier><identifier>EISBN: 1467361399</identifier><identifier>EISBN: 9781467361378</identifier><identifier>EISBN: 9781467361392</identifier><identifier>EISBN: 1467361372</identifier><identifier>DOI: 10.1109/EuroSimE.2013.6529916</identifier><language>eng</language><publisher>IEEE</publisher><subject>Abstracts ; Delamination ; MOSFET</subject><ispartof>2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2013, p.1-4</ispartof><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6529916$$EHTML$$P50$$Gieee$$H</linktohtml><link.rule.ids>309,310,776,780,785,786,2051,27904,54899</link.rule.ids><linktorsrc>$$Uhttps://ieeexplore.ieee.org/document/6529916$$EView_record_in_IEEE$$FView_record_in_$$GIEEE</linktorsrc></links><search><creatorcontrib>Azoui, T.</creatorcontrib><creatorcontrib>Marcault, E.</creatorcontrib><creatorcontrib>Tounsi, P.</creatorcontrib><creatorcontrib>Massol, J. L.</creatorcontrib><creatorcontrib>Dorkel, J. M.</creatorcontrib><creatorcontrib>Dupuy, P.</creatorcontrib><title>Electro-thermal modeling to quantify the electrothermal impact of the solder joint delamination on power device assemblies</title><title>2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</title><addtitle>EuroSimE</addtitle><description>This paper presents the use of 3D transient electrothermal modeling methodology to investigate the effects of delamination on power MOSFET with SnPb soldering when a charge short-circuit occurs. The results given by electro-thermal simulations allow the study of phenomena difficult to capture experimentally, like focalization of the temperature and current densities due to the structure topology and resistivity variation. The use of sintered silver instead of SnPb could reduce the delamination extension, but it gives also improvements in terms of thermal and electrical resistivities. These latest improvements are quantified in this paper.</description><subject>Abstracts</subject><subject>Delamination</subject><subject>MOSFET</subject><isbn>9781467361385</isbn><isbn>1467361380</isbn><isbn>1467361399</isbn><isbn>9781467361378</isbn><isbn>9781467361392</isbn><isbn>1467361372</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2013</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1kN1KAzEQhSMiqLVPIEJeYNdkf7LJpZTVCgUv1OsyzU40ZbNZN6lSn95gW-bAMHxnzsUh5I6znHOm7tvd5F-ta_OC8TIXdaEUF2fkmleiKQUvlTonc9XI0y3rSzIPYcsYS_9Nmivy2_ao4-Sz-ImTg54632Fvhw8aPf3awRCt2dMEKR6MJ591I-hIvfmHwfcdTnTr7RBpCgBnB4jWDzRp9D-JdfhtNVIIAd2mtxhuyIWBPuD8uGfk_bF9Wyyz1cvT8-JhlVne1DHDDtSmKLThHTBtkkAbhVhIKbpSotZMcgG1NpUosGa12ohKNkqjbCoOrJyR20OuRcT1OFkH0359rKv8A7Y3Y80</recordid><startdate>201304</startdate><enddate>201304</enddate><creator>Azoui, T.</creator><creator>Marcault, E.</creator><creator>Tounsi, P.</creator><creator>Massol, J. L.</creator><creator>Dorkel, J. M.</creator><creator>Dupuy, P.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201304</creationdate><title>Electro-thermal modeling to quantify the electrothermal impact of the solder joint delamination on power device assemblies</title><author>Azoui, T. ; Marcault, E. ; Tounsi, P. ; Massol, J. L. ; Dorkel, J. M. ; Dupuy, P.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-eda9b22cf1da0cf0cfacf9ee2886d38ecc0816a5cf462e5059b64879ce8741a03</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Abstracts</topic><topic>Delamination</topic><topic>MOSFET</topic><toplevel>online_resources</toplevel><creatorcontrib>Azoui, T.</creatorcontrib><creatorcontrib>Marcault, E.</creatorcontrib><creatorcontrib>Tounsi, P.</creatorcontrib><creatorcontrib>Massol, J. L.</creatorcontrib><creatorcontrib>Dorkel, J. M.</creatorcontrib><creatorcontrib>Dupuy, P.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Azoui, T.</au><au>Marcault, E.</au><au>Tounsi, P.</au><au>Massol, J. L.</au><au>Dorkel, J. M.</au><au>Dupuy, P.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Electro-thermal modeling to quantify the electrothermal impact of the solder joint delamination on power device assemblies</atitle><btitle>2013 14th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)</btitle><stitle>EuroSimE</stitle><date>2013-04</date><risdate>2013</risdate><spage>1</spage><epage>4</epage><pages>1-4</pages><isbn>9781467361385</isbn><isbn>1467361380</isbn><eisbn>1467361399</eisbn><eisbn>9781467361378</eisbn><eisbn>9781467361392</eisbn><eisbn>1467361372</eisbn><abstract>This paper presents the use of 3D transient electrothermal modeling methodology to investigate the effects of delamination on power MOSFET with SnPb soldering when a charge short-circuit occurs. The results given by electro-thermal simulations allow the study of phenomena difficult to capture experimentally, like focalization of the temperature and current densities due to the structure topology and resistivity variation. The use of sintered silver instead of SnPb could reduce the delamination extension, but it gives also improvements in terms of thermal and electrical resistivities. These latest improvements are quantified in this paper.</abstract><pub>IEEE</pub><doi>10.1109/EuroSimE.2013.6529916</doi><tpages>4</tpages></addata></record>
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Delamination
MOSFET
title Electro-thermal modeling to quantify the electrothermal impact of the solder joint delamination on power device assemblies
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-23T10%3A02%3A06IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee_6IE&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Electro-thermal%20modeling%20to%20quantify%20the%20electrothermal%20impact%20of%20the%20solder%20joint%20delamination%20on%20power%20device%20assemblies&rft.btitle=2013%2014th%20International%20Conference%20on%20Thermal,%20Mechanical%20and%20Multi-Physics%20Simulation%20and%20Experiments%20in%20Microelectronics%20and%20Microsystems%20(EuroSimE)&rft.au=Azoui,%20T.&rft.date=2013-04&rft.spage=1&rft.epage=4&rft.pages=1-4&rft.isbn=9781467361385&rft.isbn_list=1467361380&rft_id=info:doi/10.1109/EuroSimE.2013.6529916&rft_dat=%3Cieee_6IE%3E6529916%3C/ieee_6IE%3E%3Curl%3E%3C/url%3E&rft.eisbn=1467361399&rft.eisbn_list=9781467361378&rft.eisbn_list=9781467361392&rft.eisbn_list=1467361372&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6529916&rfr_iscdi=true