Technology comparison for large last-level caches (L3Cs): Low-leakage SRAM, low write-energy STT-RAM, and refresh-optimized eDRAM
Large last-level caches (L 3 Cs) are frequently used to bridge the performance and power gap between processor and memory. Although traditional processors implement caches as SRAMs, technologies such as STT-RAM (MRAM), and eDRAM have been used and/or considered for the implementation of L 3 Cs. Each...
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creator | Mu-Tien Chang Rosenfeld, P. Shih-Lien Lu Jacob, B. |
description | Large last-level caches (L 3 Cs) are frequently used to bridge the performance and power gap between processor and memory. Although traditional processors implement caches as SRAMs, technologies such as STT-RAM (MRAM), and eDRAM have been used and/or considered for the implementation of L 3 Cs. Each of these technologies has inherent weaknesses: SRAM is relatively low density and has high leakage current; STT-RAM has high write latency and write energy consumption; and eDRAM requires refresh operations. As future processors are expected to have larger last-level caches, the goal of this paper is to study the trade-offs associated with using each of these technologies to implement L 3 Cs. In order to make useful comparisons between SRAM, STTRAM, and eDRAM L 3 Cs, we model them in detail and apply low power techniques to each of these technologies to address their respective weaknesses. We optimize SRAM for low leakage and optimize STT-RAM for low write energy. Moreover, we classify eDRAM refresh-reduction schemes into two categories and demonstrate the effectiveness of using dead-line prediction to eliminate unnecessary refreshes. A comparison of these technologies through full-system simulation shows that the proposed refresh-reduction method makes eDRAM a viable, energy-efficient technology for implementing L 3 Cs. |
doi_str_mv | 10.1109/HPCA.2013.6522314 |
format | Conference Proceeding |
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Although traditional processors implement caches as SRAMs, technologies such as STT-RAM (MRAM), and eDRAM have been used and/or considered for the implementation of L 3 Cs. Each of these technologies has inherent weaknesses: SRAM is relatively low density and has high leakage current; STT-RAM has high write latency and write energy consumption; and eDRAM requires refresh operations. As future processors are expected to have larger last-level caches, the goal of this paper is to study the trade-offs associated with using each of these technologies to implement L 3 Cs. In order to make useful comparisons between SRAM, STTRAM, and eDRAM L 3 Cs, we model them in detail and apply low power techniques to each of these technologies to address their respective weaknesses. We optimize SRAM for low leakage and optimize STT-RAM for low write energy. Moreover, we classify eDRAM refresh-reduction schemes into two categories and demonstrate the effectiveness of using dead-line prediction to eliminate unnecessary refreshes. 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Moreover, we classify eDRAM refresh-reduction schemes into two categories and demonstrate the effectiveness of using dead-line prediction to eliminate unnecessary refreshes. A comparison of these technologies through full-system simulation shows that the proposed refresh-reduction method makes eDRAM a viable, energy-efficient technology for implementing L 3 Cs.</description><subject>Capacitors</subject><subject>CMOS integrated circuits</subject><subject>CMOS technology</subject><subject>Magnetic tunneling</subject><subject>Radiation detectors</subject><subject>Random access memory</subject><subject>Transistors</subject><issn>1530-0897</issn><issn>2378-203X</issn><isbn>1467355852</isbn><isbn>9781467355858</isbn><isbn>9781467355872</isbn><isbn>1467355860</isbn><isbn>1467355879</isbn><isbn>9781467355865</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2013</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo1kDtPwzAYRc1Loi39AYjFI0i4-FHHMVsVHkUKAtEgsVVO8rkNpHFlR1Rl458TQVnuHc7VGS5Cp4yOGKP6avqcTEacMjGKJOeCjffQUKuYjSMlpIwV30c9LlRMOBVvB6j_DyQ_RD0mBSU01uoY9UN4p5RyLVkPfWdQLBtXu8UWF261Nr4KrsHWeVwbv4AuQ0tq-IQaF6ZYQsDnqUjCxTVO3aYD5sN0q9nL5PES126DN75qgUADvjPOsoz8EtOU2IP1EJbErdtqVX1BieGmgyfoyJo6wHDXA_R6d5slU5I-3T8kk5QUnI5bkkdMRcJGUGoLRa7KWEtRCh1by0HaseKWF1xCLmLFDONlpE0MeWllZHPNhRigsz9vBQDzta9Wxm_nuyvFD9lcY4I</recordid><startdate>201302</startdate><enddate>201302</enddate><creator>Mu-Tien Chang</creator><creator>Rosenfeld, P.</creator><creator>Shih-Lien Lu</creator><creator>Jacob, B.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201302</creationdate><title>Technology comparison for large last-level caches (L3Cs): Low-leakage SRAM, low write-energy STT-RAM, and refresh-optimized eDRAM</title><author>Mu-Tien Chang ; Rosenfeld, P. ; Shih-Lien Lu ; Jacob, B.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-c204t-b61763f6ed9fecb7d8953d398ff2e5f472f2c25eb3871a12d69a8ebdf56fb9233</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2013</creationdate><topic>Capacitors</topic><topic>CMOS integrated circuits</topic><topic>CMOS technology</topic><topic>Magnetic tunneling</topic><topic>Radiation detectors</topic><topic>Random access memory</topic><topic>Transistors</topic><toplevel>online_resources</toplevel><creatorcontrib>Mu-Tien Chang</creatorcontrib><creatorcontrib>Rosenfeld, P.</creatorcontrib><creatorcontrib>Shih-Lien Lu</creatorcontrib><creatorcontrib>Jacob, B.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Mu-Tien Chang</au><au>Rosenfeld, P.</au><au>Shih-Lien Lu</au><au>Jacob, B.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Technology comparison for large last-level caches (L3Cs): Low-leakage SRAM, low write-energy STT-RAM, and refresh-optimized eDRAM</atitle><btitle>2013 IEEE 19th International Symposium on High Performance Computer Architecture (HPCA)</btitle><stitle>HPCA</stitle><date>2013-02</date><risdate>2013</risdate><spage>143</spage><epage>154</epage><pages>143-154</pages><issn>1530-0897</issn><eissn>2378-203X</eissn><isbn>1467355852</isbn><isbn>9781467355858</isbn><eisbn>9781467355872</eisbn><eisbn>1467355860</eisbn><eisbn>1467355879</eisbn><eisbn>9781467355865</eisbn><abstract>Large last-level caches (L 3 Cs) are frequently used to bridge the performance and power gap between processor and memory. Although traditional processors implement caches as SRAMs, technologies such as STT-RAM (MRAM), and eDRAM have been used and/or considered for the implementation of L 3 Cs. Each of these technologies has inherent weaknesses: SRAM is relatively low density and has high leakage current; STT-RAM has high write latency and write energy consumption; and eDRAM requires refresh operations. As future processors are expected to have larger last-level caches, the goal of this paper is to study the trade-offs associated with using each of these technologies to implement L 3 Cs. In order to make useful comparisons between SRAM, STTRAM, and eDRAM L 3 Cs, we model them in detail and apply low power techniques to each of these technologies to address their respective weaknesses. We optimize SRAM for low leakage and optimize STT-RAM for low write energy. Moreover, we classify eDRAM refresh-reduction schemes into two categories and demonstrate the effectiveness of using dead-line prediction to eliminate unnecessary refreshes. A comparison of these technologies through full-system simulation shows that the proposed refresh-reduction method makes eDRAM a viable, energy-efficient technology for implementing L 3 Cs.</abstract><pub>IEEE</pub><doi>10.1109/HPCA.2013.6522314</doi><tpages>12</tpages></addata></record> |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Capacitors CMOS integrated circuits CMOS technology Magnetic tunneling Radiation detectors Random access memory Transistors |
title | Technology comparison for large last-level caches (L3Cs): Low-leakage SRAM, low write-energy STT-RAM, and refresh-optimized eDRAM |
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