Alloyed copper bonding wire with homogeneous microstructure
The new alloyed copper (Cu) wire exhibited homogeneous free air ball (FAB) formation and better electrochemical corrosion resistance than that of bare Cu wire. It also has comparable electrochemical corrosion resistance as palladium (Pd) coated Cu wire. The softness of the alloyed Cu wire and its FA...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Tagungsbericht |
| Sprache: | eng |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!