Mitigation of Unintentional Radiated Emissions from Tall VLSI Heatsinks Using Ground Posts
When a heatsink is mounted on an integrated circuit (IC) package above a printed circuit board (PCB), noise from the IC can be coupled to the board-heatsink structure causing radiated emissions. One method to reduce these emissions is to connect the heatsink to the PCB using shorting posts. This pap...
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| Veröffentlicht in: | IEEE transactions on electromagnetic compatibility 2013-12, Vol.55 (6), p.1271-1276 |
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| container_title | IEEE transactions on electromagnetic compatibility |
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| creator | Xinbo He Hubing, Todd H. |
| description | When a heatsink is mounted on an integrated circuit (IC) package above a printed circuit board (PCB), noise from the IC can be coupled to the board-heatsink structure causing radiated emissions. One method to reduce these emissions is to connect the heatsink to the PCB using shorting posts. This paper examines the effectiveness of shorting posts for reducing the radiated emissions from tall heatsinks, based on the partial inductance of the posts. A closed-form expression is derived for calculating the reduction in emissions that is obtained by shorting posts mounted symmetrically around the perimeter of the heatsink. The effectiveness of connecting the posts to the board through a resistance to damp resonant peaks is also discussed. |
| doi_str_mv | 10.1109/TEMC.2013.2259629 |
| format | Article |
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One method to reduce these emissions is to connect the heatsink to the PCB using shorting posts. This paper examines the effectiveness of shorting posts for reducing the radiated emissions from tall heatsinks, based on the partial inductance of the posts. A closed-form expression is derived for calculating the reduction in emissions that is obtained by shorting posts mounted symmetrically around the perimeter of the heatsink. The effectiveness of connecting the posts to the board through a resistance to damp resonant peaks is also discussed.</description><identifier>ISSN: 0018-9375</identifier><identifier>EISSN: 1558-187X</identifier><identifier>DOI: 10.1109/TEMC.2013.2259629</identifier><identifier>CODEN: IEMCAE</identifier><language>eng</language><publisher>New York, NY: IEEE</publisher><subject>Applied sciences ; Circuit board ; Design. Technologies. Operation analysis. Testing ; electromagnetic (EM) radiation ; electromagnetic interference (EMI) ; Electronic equipment and fabrication. Passive components, printed wiring boards, connectics ; Electronics ; Exact sciences and technology ; Fluctuation phenomena, random processes, noise, and brownian motion ; Heat sinks ; heatsink ; Impedance ; Inductance ; Integrated circuits ; Noise ; Physics ; Resistance ; Resonant frequency ; Semiconductor electronics. Microelectronics. Optoelectronics. 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One method to reduce these emissions is to connect the heatsink to the PCB using shorting posts. This paper examines the effectiveness of shorting posts for reducing the radiated emissions from tall heatsinks, based on the partial inductance of the posts. A closed-form expression is derived for calculating the reduction in emissions that is obtained by shorting posts mounted symmetrically around the perimeter of the heatsink. The effectiveness of connecting the posts to the board through a resistance to damp resonant peaks is also discussed.</description><subject>Applied sciences</subject><subject>Circuit board</subject><subject>Design. Technologies. Operation analysis. Testing</subject><subject>electromagnetic (EM) radiation</subject><subject>electromagnetic interference (EMI)</subject><subject>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Fluctuation phenomena, random processes, noise, and brownian motion</subject><subject>Heat sinks</subject><subject>heatsink</subject><subject>Impedance</subject><subject>Inductance</subject><subject>Integrated circuits</subject><subject>Noise</subject><subject>Physics</subject><subject>Resistance</subject><subject>Resonant frequency</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. 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Technologies. Operation analysis. Testing</topic><topic>electromagnetic (EM) radiation</topic><topic>electromagnetic interference (EMI)</topic><topic>Electronic equipment and fabrication. Passive components, printed wiring boards, connectics</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Fluctuation phenomena, random processes, noise, and brownian motion</topic><topic>Heat sinks</topic><topic>heatsink</topic><topic>Impedance</topic><topic>Inductance</topic><topic>Integrated circuits</topic><topic>Noise</topic><topic>Physics</topic><topic>Resistance</topic><topic>Resonant frequency</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Statistical physics, thermodynamics, and nonlinear dynamical systems</topic><topic>Transistors</topic><topic>Very large scale integration</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>Xinbo He</creatorcontrib><creatorcontrib>Hubing, Todd H.</creatorcontrib><collection>IEEE All-Society Periodicals Package (ASPP) 2005-present</collection><collection>IEEE All-Society Periodicals Package (ASPP) 1998-Present</collection><collection>IEEE Electronic Library (IEL)</collection><collection>Pascal-Francis</collection><collection>CrossRef</collection><jtitle>IEEE transactions on electromagnetic compatibility</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Xinbo He</au><au>Hubing, Todd H.</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>Mitigation of Unintentional Radiated Emissions from Tall VLSI Heatsinks Using Ground Posts</atitle><jtitle>IEEE transactions on electromagnetic compatibility</jtitle><stitle>TEMC</stitle><date>2013-12-01</date><risdate>2013</risdate><volume>55</volume><issue>6</issue><spage>1271</spage><epage>1276</epage><pages>1271-1276</pages><issn>0018-9375</issn><eissn>1558-187X</eissn><coden>IEMCAE</coden><abstract>When a heatsink is mounted on an integrated circuit (IC) package above a printed circuit board (PCB), noise from the IC can be coupled to the board-heatsink structure causing radiated emissions. One method to reduce these emissions is to connect the heatsink to the PCB using shorting posts. This paper examines the effectiveness of shorting posts for reducing the radiated emissions from tall heatsinks, based on the partial inductance of the posts. A closed-form expression is derived for calculating the reduction in emissions that is obtained by shorting posts mounted symmetrically around the perimeter of the heatsink. The effectiveness of connecting the posts to the board through a resistance to damp resonant peaks is also discussed.</abstract><cop>New York, NY</cop><pub>IEEE</pub><doi>10.1109/TEMC.2013.2259629</doi><tpages>6</tpages></addata></record> |
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| subjects | Applied sciences Circuit board Design. Technologies. Operation analysis. Testing electromagnetic (EM) radiation electromagnetic interference (EMI) Electronic equipment and fabrication. Passive components, printed wiring boards, connectics Electronics Exact sciences and technology Fluctuation phenomena, random processes, noise, and brownian motion Heat sinks heatsink Impedance Inductance Integrated circuits Noise Physics Resistance Resonant frequency Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Statistical physics, thermodynamics, and nonlinear dynamical systems Transistors Very large scale integration |
| title | Mitigation of Unintentional Radiated Emissions from Tall VLSI Heatsinks Using Ground Posts |
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