Thermomechanical stress-aware management for 3D IC designs

The thermomechanical stress has been considered as one of the most challenging problems in three-dimensional integration circuits (3D ICs), due to the thermal expansion coefficient mismatch between the through-silicon vias (TSVs) and silicon substrate, and the presence of elevated thermal gradients....

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Zou, Qiaosha, Zhang, Tao, Kursun, Eren, Xie, Yuan
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Stress Thermal analysis Thermal loading Thermal management Three-dimensional displays Through-silicon vias
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