Development of thermal test chip for GaN-on-Si device hotspot characterization

The design and fabrication of thermal test chip, specifically for electronic hotspot cooling solution development and characterization are presented. The silicon thermal test chip is designed to simulate a working GaN-on-Si high power device and consists of two main components, which are heater and...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Lau, B. L., Lee, Y. J., Leong, Y. C., Choo, K. F., Zhang, X., Chan, P. K.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!