Flow modeling of die attach process and the optimization of process parameters in advance packaging

This paper presents a new numerical model to characterize the die attach process in the advance packaging. With its successful application on a 5 mm by 5 mm with 70um thickness die attached to the substrate, final fillet shape of the die attach material is predicted for various process conditions. F...

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Bibliographische Detailangaben

Hauptverfasser:	Lin Ji, Leong Ching Wai, Rhee, M. W. D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Conferences Decision support systems Electronics packaging Hafnium
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