Study on mold flow during compression molding for embedded wafer level package (EMWLP) with multiple chips

The rapidly increasing demand of embedded wafer level package (EMWLP) due to its advantages, smaller form factor and flexibility in system level integration leads to the development of reconstructed wafer level encapsulation. The reconstructed wafers are encapsulated with epoxy molding compound usin...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Sorono, D. V., Ji Lin, Chai Tai Chong, Ser Choong Chong, Vempati, S. R.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Compounds Compression molding Filling Layout Mathematical model Semiconductor device modeling Shape
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!