Process related challenges for 3D face to face stacking test vehicles using a 40/50μm pitch CuSn microbump configuration

There are several motivations for moving to 3D IC technology. One of the key factors is performance enhancement which can be achieved by further miniaturization of the IC. As more and more functionality is required on a smaller footprint, 3D stacking is a very valuable solution. The increased use of...

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Bibliographische Detailangaben

Hauptverfasser:	Bogaerts, L., De Vos, J., Gerets, C., Jamieson, G., Vandersmissen, K., La Manna, A.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Conferences Decision support systems Electronics packaging
Online-Zugang:	Volltext bestellen
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