Design and development of micro-sensors for measuring localised stresses during copper wirebonding

In wirebonding, high stresses applied onto the pad during the ultrasonic bonding can result in pad damage, silicon cratering and aluminium splash - all of which ultimately result in poor joint quality. Cracking in the Cu/low-k and Cu/ultra low-k layers beneath the pad (also a result of high applied...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Xiaowu Zhang, Selvanayagam, C. S., Woon Yik Yong, Chai, T. C., Trigg, A. D.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Resistors Sensor arrays Stress Stress measurement Wires
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!