3D volumetric ultrasound imaging with a 32×32 CMUT array integrated with front-end ICs using flip-chip bonding technology

3D ultrasound imaging is becoming increasingly prevalent in the medical field. Compared to conventional 2D imaging systems, 3D imaging can provide a detailed view of tissue structures that makes diagnosis easier for the physicians. In addition, 2D image slices can be formed at various orientations t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Bhuyan, A., Choe, J. W., Byung Chul Lee, Wygant, I., Nikoozadeh, A., Oralkan, O., Khuri-Yakub, B. T.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Arrays Bonding Flip-chip devices Imaging Integrated circuits Three-dimensional displays Ultrasonic imaging
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