Dissipating heat from hot spot using a new nano thermal interface material

The need for faster, smaller, more reliable and efficient products has resulted in increased heat generated in microelectronic components. Removal of the heat generated is an important issue in electronic packaging. Therefore, a novel Nano-Thermal Interface Material was developed to improve this. Th...

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Bibliographische Detailangaben

Hauptverfasser:	Shuangxi Sun, Wei Mu, Yan Zhang, Carlberg, Bjorn, Lilei Ye, Liu, Johan
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Materials Metals Microassembly Resistance heating Thermal resistance
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