Millimeter-wave power amplifier module using redistribution layer technology

This paper presents a 77-GHz band high-power CMOS amplifier module. In an effort to integrate MMIC with low-loss passive circuits, multi-layered redistribution layer (RDL) technology has been installed. Passive circuits made using RDL technology and 65-nm CMOS circuits are enabling breakthrough appr...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Sato, M., Ishizuki, Y., Sasaki, S., Matsumura, H., Suzuki, T., Tani, M.
Format:	Tagungsbericht
Sprache:	eng ; jpn
Schlagworte:	CMOS CMOS integrated circuits CMOS technology Passive circuits Power amplifier Power amplifiers Power generation RDL Semiconductor device measurement Transmission line measurements Wilkinson combiner WLP
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