Packaging designs and flexural stress estimation for thin-film types of OLED devices
Fatigue behavior with an extreme flexural stress loaded on OLED devices has been greatly paid attention while the packaging structure having multi-stacked films becomes thinner and more flexible. To reduce mechanical impact and enhance reliability for OLED and related critical film materials, a deri...
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creator | Chang-Chun Lee Chih-Sheng Wu Tzai-Liang Tzeng Chia-Hao Tsai Shu-Tang Yeh Yi-Hao Peng Kuang-Jung Chen |
description | Fatigue behavior with an extreme flexural stress loaded on OLED devices has been greatly paid attention while the packaging structure having multi-stacked films becomes thinner and more flexible. To reduce mechanical impact and enhance reliability for OLED and related critical film materials, a derived mechanical model of plural layers is presented. Moreover, a nonlinear finite element analysis combined with the approach of full factorial design is performed to explore several concerned mechanical parameters within a whole structure. The results reveal that the thickness of PI_substrate is the most dominant to determine the position of neutral axis and the bending stress of indium tin oxide film, separately. It is also found that all the significances of main effects for each factor are obviously larger than the interaction effect among them. Consequently, the use of either thinner film or softer constitute for each layer could be able to reduce ITO stress effectively. |
doi_str_mv | 10.1109/IMPACT.2012.6420302 |
format | Conference Proceeding |
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To reduce mechanical impact and enhance reliability for OLED and related critical film materials, a derived mechanical model of plural layers is presented. Moreover, a nonlinear finite element analysis combined with the approach of full factorial design is performed to explore several concerned mechanical parameters within a whole structure. The results reveal that the thickness of PI_substrate is the most dominant to determine the position of neutral axis and the bending stress of indium tin oxide film, separately. It is also found that all the significances of main effects for each factor are obviously larger than the interaction effect among them. 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To reduce mechanical impact and enhance reliability for OLED and related critical film materials, a derived mechanical model of plural layers is presented. Moreover, a nonlinear finite element analysis combined with the approach of full factorial design is performed to explore several concerned mechanical parameters within a whole structure. The results reveal that the thickness of PI_substrate is the most dominant to determine the position of neutral axis and the bending stress of indium tin oxide film, separately. It is also found that all the significances of main effects for each factor are obviously larger than the interaction effect among them. Consequently, the use of either thinner film or softer constitute for each layer could be able to reduce ITO stress effectively.</description><subject>Finite element analysis (FEA)</subject><subject>Flexural stress</subject><subject>Indium tin oxide</subject><subject>ITO</subject><subject>Neural axis</subject><subject>OLED</subject><subject>Organic light emitting diodes</subject><subject>Packaging</subject><subject>Stress</subject><subject>Substrates</subject><subject>Young's modulus</subject><issn>2150-5934</issn><issn>2150-5942</issn><isbn>9781467316354</isbn><isbn>1467316350</isbn><isbn>1467316377</isbn><isbn>1467316385</isbn><isbn>9781467316385</isbn><isbn>9781467316378</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2012</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>RIE</sourceid><recordid>eNo9kM1OwkAURse_RESegM28QPHe-enYJUFUkhpY4JoM03txtBTSqUbeXhLR1bc4ycnJJ8QQYYQIxd3sZTGeLEcKUI1yo0CDOhM3aHKnMdfOnYueQguZLYy6EIPC3f8xay7_mTbXYpDSO8BRgGC06YnlwocPv4nNRlaU4qZJ0jeV5Jq-P1tfy9S1lJKk1MWt7-KukbxrZfcWm4xjvZXdYU9J7ljOy-nDUfEVA6VbccW-TjQ4bV-8Pk6Xk-esnD_NJuMyi-hsl-WB7RoseEIO5DAvcB0QgE3QipWqkMkFUBBQKw1r5iJH69kgIvmq0n0x_PVGIlrt22Nie1idDtI_CO9WAA</recordid><startdate>201210</startdate><enddate>201210</enddate><creator>Chang-Chun Lee</creator><creator>Chih-Sheng Wu</creator><creator>Tzai-Liang Tzeng</creator><creator>Chia-Hao Tsai</creator><creator>Shu-Tang Yeh</creator><creator>Yi-Hao Peng</creator><creator>Kuang-Jung Chen</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201210</creationdate><title>Packaging designs and flexural stress estimation for thin-film types of OLED devices</title><author>Chang-Chun Lee ; Chih-Sheng Wu ; Tzai-Liang Tzeng ; Chia-Hao Tsai ; Shu-Tang Yeh ; Yi-Hao Peng ; Kuang-Jung Chen</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i175t-6cf5b050ae1fce71691bc100f4c32f22d1fe7c020c13230bff9615af4111eadd3</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2012</creationdate><topic>Finite element analysis (FEA)</topic><topic>Flexural stress</topic><topic>Indium tin oxide</topic><topic>ITO</topic><topic>Neural axis</topic><topic>OLED</topic><topic>Organic light emitting diodes</topic><topic>Packaging</topic><topic>Stress</topic><topic>Substrates</topic><topic>Young's modulus</topic><toplevel>online_resources</toplevel><creatorcontrib>Chang-Chun Lee</creatorcontrib><creatorcontrib>Chih-Sheng Wu</creatorcontrib><creatorcontrib>Tzai-Liang Tzeng</creatorcontrib><creatorcontrib>Chia-Hao Tsai</creatorcontrib><creatorcontrib>Shu-Tang Yeh</creatorcontrib><creatorcontrib>Yi-Hao Peng</creatorcontrib><creatorcontrib>Kuang-Jung Chen</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>Chang-Chun Lee</au><au>Chih-Sheng Wu</au><au>Tzai-Liang Tzeng</au><au>Chia-Hao Tsai</au><au>Shu-Tang Yeh</au><au>Yi-Hao Peng</au><au>Kuang-Jung Chen</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Packaging designs and flexural stress estimation for thin-film types of OLED devices</atitle><btitle>2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT)</btitle><stitle>IMPACT</stitle><date>2012-10</date><risdate>2012</risdate><spage>415</spage><epage>418</epage><pages>415-418</pages><issn>2150-5934</issn><eissn>2150-5942</eissn><isbn>9781467316354</isbn><isbn>1467316350</isbn><eisbn>1467316377</eisbn><eisbn>1467316385</eisbn><eisbn>9781467316385</eisbn><eisbn>9781467316378</eisbn><abstract>Fatigue behavior with an extreme flexural stress loaded on OLED devices has been greatly paid attention while the packaging structure having multi-stacked films becomes thinner and more flexible. To reduce mechanical impact and enhance reliability for OLED and related critical film materials, a derived mechanical model of plural layers is presented. Moreover, a nonlinear finite element analysis combined with the approach of full factorial design is performed to explore several concerned mechanical parameters within a whole structure. The results reveal that the thickness of PI_substrate is the most dominant to determine the position of neutral axis and the bending stress of indium tin oxide film, separately. It is also found that all the significances of main effects for each factor are obviously larger than the interaction effect among them. Consequently, the use of either thinner film or softer constitute for each layer could be able to reduce ITO stress effectively.</abstract><pub>IEEE</pub><doi>10.1109/IMPACT.2012.6420302</doi><tpages>4</tpages></addata></record> |
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identifier | ISSN: 2150-5934 |
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language | eng |
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source | IEEE Electronic Library (IEL) Conference Proceedings |
subjects | Finite element analysis (FEA) Flexural stress Indium tin oxide ITO Neural axis OLED Organic light emitting diodes Packaging Stress Substrates Young's modulus |
title | Packaging designs and flexural stress estimation for thin-film types of OLED devices |
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