Packaging designs and flexural stress estimation for thin-film types of OLED devices

Fatigue behavior with an extreme flexural stress loaded on OLED devices has been greatly paid attention while the packaging structure having multi-stacked films becomes thinner and more flexible. To reduce mechanical impact and enhance reliability for OLED and related critical film materials, a deri...

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Hauptverfasser: Chang-Chun Lee, Chih-Sheng Wu, Tzai-Liang Tzeng, Chia-Hao Tsai, Shu-Tang Yeh, Yi-Hao Peng, Kuang-Jung Chen
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container_start_page 415
container_title
container_volume
creator Chang-Chun Lee
Chih-Sheng Wu
Tzai-Liang Tzeng
Chia-Hao Tsai
Shu-Tang Yeh
Yi-Hao Peng
Kuang-Jung Chen
description Fatigue behavior with an extreme flexural stress loaded on OLED devices has been greatly paid attention while the packaging structure having multi-stacked films becomes thinner and more flexible. To reduce mechanical impact and enhance reliability for OLED and related critical film materials, a derived mechanical model of plural layers is presented. Moreover, a nonlinear finite element analysis combined with the approach of full factorial design is performed to explore several concerned mechanical parameters within a whole structure. The results reveal that the thickness of PI_substrate is the most dominant to determine the position of neutral axis and the bending stress of indium tin oxide film, separately. It is also found that all the significances of main effects for each factor are obviously larger than the interaction effect among them. Consequently, the use of either thinner film or softer constitute for each layer could be able to reduce ITO stress effectively.
doi_str_mv 10.1109/IMPACT.2012.6420302
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identifier ISSN: 2150-5934
ispartof 2012 7th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2012, p.415-418
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2150-5942
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source IEEE Electronic Library (IEL) Conference Proceedings
subjects Finite element analysis (FEA)
Flexural stress
Indium tin oxide
ITO
Neural axis
OLED
Organic light emitting diodes
Packaging
Stress
Substrates
Young's modulus
title Packaging designs and flexural stress estimation for thin-film types of OLED devices
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