Novel method of Wafer Level Packaging in the field of MEMS

Wafer Level Packaging (WLP), a new packaging technology which is dedicated to integrated circuit (IC) packaging at wafer level to replace die level packaging. WLP basically includes front-end IC foundry process and back-end device packaging process. The major benefits of WLP contain manufacture peri...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Huang, B., Hong-Da Chang, Liu, S., Liao, M., Lee, L., Lin, S., Lin, A., Hsu, B.
Format:	Tagungsbericht
Sprache:	eng
Schlagworte:	Bonding Compounds Electromagnetic compatibility Lapping Micromechanical devices Packaging Wires
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