On-wafer probing measurement and optimization of MIM capacitors for integrated passive device application

With wireless applications flourish like mobile phone, consumer end products must tend to small form factor development. More functions, less dimension, and high integration are future technology trend in chip package development roadmap. Integrated Passive Device (IPD) has these advantages in SiP a...

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Bibliographische Detailangaben
Hauptverfasser: Ho-chuan Lin, Ming-Fan Tsai, Lee, Daniel
Format: Tagungsbericht
Sprache:eng
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