Defect detection algorithm for wafer inspection based on laser scanning

A defect detection algorithm for wafer inspection based on laser scanning is presented. Microscopic anomalies, contaminants, and process induced pattern defects result in a two-dimensional (2-D) laser scattering signature, which closely resembles the coherent point-spread-function of the scanning la...

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Veröffentlicht in:IEEE transactions on semiconductor manufacturing 1997-11, Vol.10 (4), p.459-468
Hauptverfasser: Nikoonahad, M., Wayman, C.E., Biellak, S.A.
Format: Artikel
Sprache:eng
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