Thermocompression bonding for 3D RF MEMS devices using gold and silver as intermediate layer

The paper presents preliminary results on Au-Au and Ag-Ag thermocompression bonding at low temperature. For both materials, sample structures have been prepared and different bonding conditions experimented. Results are compared in order to evaluate Au and Ag bond strength and to establish the optimum parameters. Shear tests were performed to quantify the bond strength and after that SEM was employed to examine the bonded joints. Bond strength of Ag-Ag compare to Au-Au (at 300°C and under the pressure of 0.196 MPa) seems more promising.