Some technological and encapsulation issues of SAWS manufactured on langasite

This paper presents some aspects encountered in fabrication of surface acoustic wave (SAW) manufactured on langasite substrate. Results obtained after the first electrical test didn't correspond to our expectations, although all devices passed through on optical inspection. It followed the de-c...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: Dumbravescu, N., Buiculescu, V.
Format: Tagungsbericht
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page 230
container_issue
container_start_page 227
container_title
container_volume 1
creator Dumbravescu, N.
Buiculescu, V.
description This paper presents some aspects encountered in fabrication of surface acoustic wave (SAW) manufactured on langasite substrate. Results obtained after the first electrical test didn't correspond to our expectations, although all devices passed through on optical inspection. It followed the de-capsulation of defective devices and the searching for failure causes. We detected several such mechanisms and after fixing them, we encapsulated and tested again the devices. Now, all devices were functioning properly. Comparative results of electrical test (before and after fixing the failure) are given.
doi_str_mv 10.1109/SMICND.2012.6400646
format Conference Proceeding
fullrecord <record><control><sourceid>ieee</sourceid><recordid>TN_cdi_ieee_primary_6400646</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><ieee_id>6400646</ieee_id><sourcerecordid>6400646</sourcerecordid><originalsourceid>FETCH-LOGICAL-i90t-ba3d9af0a421decc98f3298cdb7f4e4159642c3dfb7db212d888640bc392bf303</originalsourceid><addsrcrecordid>eNpVkMtOwkAYhcdbIkGegM28QPGfC3NZElQkAV2URHfk71xwTGkJ0y58e5vIxtVZfMmXcw4hUwYzxsA-ltv18u1pxoHxmZIASqorMrHaMKm0AC2MuCYjLrQuQGlz849pdUtGbC7nheH6855Mcv4GgEGsrJIjsi3bY6BdcF9NW7eH5LCm2HgaGoen3NfYpbahKec-ZNpGWi4-SnrEpo_ouv4cPB1wjc0Bc-rCA7mLWOcwueSY7F6ed8vXYvO-Wi8XmyJZ6IoKhbcYASVnPjhnTRTcGucrHWWQbD404074WGlfcca9MWYYXjlheRUFiDGZ_mlTCGF_Oqcjnn_2l2_EL3XeVMs</addsrcrecordid><sourcetype>Publisher</sourcetype><iscdi>true</iscdi><recordtype>conference_proceeding</recordtype></control><display><type>conference_proceeding</type><title>Some technological and encapsulation issues of SAWS manufactured on langasite</title><source>IEEE Electronic Library (IEL) Conference Proceedings</source><creator>Dumbravescu, N. ; Buiculescu, V.</creator><creatorcontrib>Dumbravescu, N. ; Buiculescu, V.</creatorcontrib><description>This paper presents some aspects encountered in fabrication of surface acoustic wave (SAW) manufactured on langasite substrate. Results obtained after the first electrical test didn't correspond to our expectations, although all devices passed through on optical inspection. It followed the de-capsulation of defective devices and the searching for failure causes. We detected several such mechanisms and after fixing them, we encapsulated and tested again the devices. Now, all devices were functioning properly. Comparative results of electrical test (before and after fixing the failure) are given.</description><identifier>ISSN: 1545-827X</identifier><identifier>ISBN: 9781467307376</identifier><identifier>ISBN: 1467307378</identifier><identifier>EISSN: 2377-0678</identifier><identifier>EISBN: 9781467307383</identifier><identifier>EISBN: 1467307386</identifier><identifier>DOI: 10.1109/SMICND.2012.6400646</identifier><language>eng</language><publisher>IEEE</publisher><subject>failure mechanism ; langasite ; Metals ; Optical surface waves ; Ovens ; SAW ; Sputtering ; Substrates ; Surface acoustic wave devices ; Surface acoustic waves ; technological and encapsulation issues</subject><ispartof>CAS 2012 (International Semiconductor Conference), 2012, Vol.1, p.227-230</ispartof><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://ieeexplore.ieee.org/document/6400646$$EHTML$$P50$$Gieee$$Hfree_for_read</linktohtml><link.rule.ids>309,310,780,784,789,790,2058,27925,54920</link.rule.ids></links><search><creatorcontrib>Dumbravescu, N.</creatorcontrib><creatorcontrib>Buiculescu, V.</creatorcontrib><title>Some technological and encapsulation issues of SAWS manufactured on langasite</title><title>CAS 2012 (International Semiconductor Conference)</title><addtitle>SMICND</addtitle><description>This paper presents some aspects encountered in fabrication of surface acoustic wave (SAW) manufactured on langasite substrate. Results obtained after the first electrical test didn't correspond to our expectations, although all devices passed through on optical inspection. It followed the de-capsulation of defective devices and the searching for failure causes. We detected several such mechanisms and after fixing them, we encapsulated and tested again the devices. Now, all devices were functioning properly. Comparative results of electrical test (before and after fixing the failure) are given.</description><subject>failure mechanism</subject><subject>langasite</subject><subject>Metals</subject><subject>Optical surface waves</subject><subject>Ovens</subject><subject>SAW</subject><subject>Sputtering</subject><subject>Substrates</subject><subject>Surface acoustic wave devices</subject><subject>Surface acoustic waves</subject><subject>technological and encapsulation issues</subject><issn>1545-827X</issn><issn>2377-0678</issn><isbn>9781467307376</isbn><isbn>1467307378</isbn><isbn>9781467307383</isbn><isbn>1467307386</isbn><fulltext>true</fulltext><rsrctype>conference_proceeding</rsrctype><creationdate>2012</creationdate><recordtype>conference_proceeding</recordtype><sourceid>6IE</sourceid><sourceid>ESBDL</sourceid><sourceid>RIE</sourceid><recordid>eNpVkMtOwkAYhcdbIkGegM28QPGfC3NZElQkAV2URHfk71xwTGkJ0y58e5vIxtVZfMmXcw4hUwYzxsA-ltv18u1pxoHxmZIASqorMrHaMKm0AC2MuCYjLrQuQGlz849pdUtGbC7nheH6855Mcv4GgEGsrJIjsi3bY6BdcF9NW7eH5LCm2HgaGoen3NfYpbahKec-ZNpGWi4-SnrEpo_ouv4cPB1wjc0Bc-rCA7mLWOcwueSY7F6ed8vXYvO-Wi8XmyJZ6IoKhbcYASVnPjhnTRTcGucrHWWQbD404074WGlfcca9MWYYXjlheRUFiDGZ_mlTCGF_Oqcjnn_2l2_EL3XeVMs</recordid><startdate>201210</startdate><enddate>201210</enddate><creator>Dumbravescu, N.</creator><creator>Buiculescu, V.</creator><general>IEEE</general><scope>6IE</scope><scope>6IL</scope><scope>CBEJK</scope><scope>ESBDL</scope><scope>RIE</scope><scope>RIL</scope></search><sort><creationdate>201210</creationdate><title>Some technological and encapsulation issues of SAWS manufactured on langasite</title><author>Dumbravescu, N. ; Buiculescu, V.</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-i90t-ba3d9af0a421decc98f3298cdb7f4e4159642c3dfb7db212d888640bc392bf303</frbrgroupid><rsrctype>conference_proceedings</rsrctype><prefilter>conference_proceedings</prefilter><language>eng</language><creationdate>2012</creationdate><topic>failure mechanism</topic><topic>langasite</topic><topic>Metals</topic><topic>Optical surface waves</topic><topic>Ovens</topic><topic>SAW</topic><topic>Sputtering</topic><topic>Substrates</topic><topic>Surface acoustic wave devices</topic><topic>Surface acoustic waves</topic><topic>technological and encapsulation issues</topic><toplevel>online_resources</toplevel><creatorcontrib>Dumbravescu, N.</creatorcontrib><creatorcontrib>Buiculescu, V.</creatorcontrib><collection>IEEE Electronic Library (IEL) Conference Proceedings</collection><collection>IEEE Proceedings Order Plan All Online (POP All Online) 1998-present by volume</collection><collection>IEEE Xplore All Conference Proceedings</collection><collection>IEEE Open Access Journals</collection><collection>IEEE Electronic Library (IEL)</collection><collection>IEEE Proceedings Order Plans (POP All) 1998-Present</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>Dumbravescu, N.</au><au>Buiculescu, V.</au><format>book</format><genre>proceeding</genre><ristype>CONF</ristype><atitle>Some technological and encapsulation issues of SAWS manufactured on langasite</atitle><btitle>CAS 2012 (International Semiconductor Conference)</btitle><stitle>SMICND</stitle><date>2012-10</date><risdate>2012</risdate><volume>1</volume><spage>227</spage><epage>230</epage><pages>227-230</pages><issn>1545-827X</issn><eissn>2377-0678</eissn><isbn>9781467307376</isbn><isbn>1467307378</isbn><eisbn>9781467307383</eisbn><eisbn>1467307386</eisbn><abstract>This paper presents some aspects encountered in fabrication of surface acoustic wave (SAW) manufactured on langasite substrate. Results obtained after the first electrical test didn't correspond to our expectations, although all devices passed through on optical inspection. It followed the de-capsulation of defective devices and the searching for failure causes. We detected several such mechanisms and after fixing them, we encapsulated and tested again the devices. Now, all devices were functioning properly. Comparative results of electrical test (before and after fixing the failure) are given.</abstract><pub>IEEE</pub><doi>10.1109/SMICND.2012.6400646</doi><tpages>4</tpages><oa>free_for_read</oa></addata></record>
fulltext fulltext
identifier ISSN: 1545-827X
ispartof CAS 2012 (International Semiconductor Conference), 2012, Vol.1, p.227-230
issn 1545-827X
2377-0678
language eng
recordid cdi_ieee_primary_6400646
source IEEE Electronic Library (IEL) Conference Proceedings
subjects failure mechanism
langasite
Metals
Optical surface waves
Ovens
SAW
Sputtering
Substrates
Surface acoustic wave devices
Surface acoustic waves
technological and encapsulation issues
title Some technological and encapsulation issues of SAWS manufactured on langasite
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-01T12%3A27%3A39IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-ieee&rft_val_fmt=info:ofi/fmt:kev:mtx:book&rft.genre=proceeding&rft.atitle=Some%20technological%20and%20encapsulation%20issues%20of%20SAWS%20manufactured%20on%20langasite&rft.btitle=CAS%202012%20(International%20Semiconductor%20Conference)&rft.au=Dumbravescu,%20N.&rft.date=2012-10&rft.volume=1&rft.spage=227&rft.epage=230&rft.pages=227-230&rft.issn=1545-827X&rft.eissn=2377-0678&rft.isbn=9781467307376&rft.isbn_list=1467307378&rft_id=info:doi/10.1109/SMICND.2012.6400646&rft_dat=%3Cieee%3E6400646%3C/ieee%3E%3Curl%3E%3C/url%3E&rft.eisbn=9781467307383&rft.eisbn_list=1467307386&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rft_ieee_id=6400646&rfr_iscdi=true